BS EN 61191-1:2013

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Printed board assemblies – Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies

Published By	Publication Date	Number of Pages
BSI	2013	52

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Description

This part of IEC 61191 prescribes requirements for materials, methods and verification criteria for producing quality soldered interconnections and assemblies using surface mount and related assembly technologies. This part of IEC 61191 also includes recommendations for good manufacturing processes.

Additional information

Status	Withdrawn
Title	Printed board assemblies – Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
Replaces	BS EN 61191-1:1999
Publisher	BSI
Committee	EPL/501
Pages	52
Publication Date	2013-09-30
Withdrawn Date	2018-11-13
ISBN	978 0 580 77063 0
Standard Number	BS EN 61191-1:2013
Identical National Standard Of	IEC 61191-1:2013, EN 61191-1:2013, IEC TS 62312-1-1:2018
Descriptors	Electrical components, Surface mounting devices, Integrated circuits, Quality assurance systems, Inspection, Performance, Printed circuits, Semiconductor devices, Ordering, Process control, Quality assurance, Flatness (surface), Working conditions (physical), Fluxes (materials), Cleaning, Visual inspection (testing), Acceptance (approval), Surface mounting, Contaminants, Classification systems, Soldering, Wires, Joints, Coating processes, Defects, Verification, Printed-circuit boards, Design, Microassembling, Assembling, Assessed quality, Personnel, Approval testing, Electronic equipment and components, Conformity, Wettability, Electrical resistance, Components
ICS Codes	31.240 - Mechanical structures for electronic equipment

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BS EN 61191-1:2013

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