BS EN 60749-9:2002

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Semiconductor devices. Mechanical and climatic test methods – Permanence of marking

Published By	Publication Date	Number of Pages
BSI	2002	10

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Categories: 31.080.01 - Semiconductor devices in general, BSI

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Description

Aims at testing and verifying that the markings on semiconductor devices will not become illegible when subject to solvents or cleaning solutions commonly used during the removal of solder flux residue from the printed circuit board assembly process. This test is applicable for all package types. The test should be considered non-destructive. The contents of the corrigendum of August 2003 have been included in this copy.

Additional information

Status	Withdrawn
Partially Replaces	BS EN 60749:1999
Title	Semiconductor devices. Mechanical and climatic test methods – Permanence of marking
Publisher	BSI
Committee	EPL/47
Pages	10
Publication Date	2002-09-24
Withdrawn Date	2017-11-27
Replaced By	BS EN 60749-9:2017
ISBN	0 580 40396 3
Standard Number	BS EN 60749-9:2002
Identical National Standard Of	IEC 60749-9:2002, EN 60749-9 (IEC 60749-9:2002) AS
Descriptors	Mechanical testing, Environmental testing, Non-destructive testing, Marking, Integrated circuits, Permanent, Semiconductor devices, Chemical-resistance tests, Electronic equipment and components, Climate, Solvent-resistance tests
ICS Codes	31.080.01 - Semiconductor devices in general

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BS EN 60749-9:2002

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