BS EN 60749-8:2003
$102.76
Semiconductor devices. Mechanical and climatic test methods – Sealing
Published By | Publication Date | Number of Pages |
BSI | 2003 | 20 |
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Applicable to semiconductor devices (discrete devices and integrated circuits), it determines the leak rate of semiconductor devices. The contents of the corrigenda of April 2003 and August 2003 have been included in this copy.
Status | Definitive |
---|---|
Pages | 20 |
Publication Date | 2003-07-03 |
ISBN | 0 580 42201 1 |
Standard Number | BS EN 60749-8:2003 |
Title | Semiconductor devices. Mechanical and climatic test methods – Sealing |
Identical National Standard Of | EN 60749-8:2003, IEC 60749-8:2002, IEC 60749-8:2002/COR1:2003 |
Replaces | BS EN 60749:1999 |
Descriptors | Climate, Leak tests, Integrated circuits, Semiconductor devices, Environmental testing, Electronic equipment and components, Mechanical testing, Seals |
Publisher | BSI |
Committee | EPL/47 |
ICS Codes | 31.080.01 - Semiconductor devices in general |
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