| PDF Pages<\/th>\n | PDF Title<\/th>\n<\/tr>\n | ||||||
|---|---|---|---|---|---|---|---|
| 2<\/td>\n | undefined <\/td>\n<\/tr>\n | ||||||
| 5<\/td>\n | Annex ZA(normative)Normative references to international publicationswith their corresponding European publications <\/td>\n<\/tr>\n | ||||||
| 7<\/td>\n | English CONTENTS <\/td>\n<\/tr>\n | ||||||
| 9<\/td>\n | FOREWORD <\/td>\n<\/tr>\n | ||||||
| 11<\/td>\n | INTRODUCTION <\/td>\n<\/tr>\n | ||||||
| 12<\/td>\n | 1 Scope 2 Normative references <\/td>\n<\/tr>\n | ||||||
| 13<\/td>\n | 3 Terms and definitions 4 Product categories and applications <\/td>\n<\/tr>\n | ||||||
| 14<\/td>\n | 5 Failure 5.1 Failure distribution Tables Table 1 \u2013 Examples of product categories <\/td>\n<\/tr>\n | ||||||
| 15<\/td>\n | 5.2 Early failure 5.2.1 Description Figures Figure 1 \u2013 Bathtub curve <\/td>\n<\/tr>\n | ||||||
| 16<\/td>\n | 5.2.2 Early failure rate Figure 2 \u2013 Failure process of IC manufacturing lotsduring the early failure period <\/td>\n<\/tr>\n | ||||||
| 17<\/td>\n | Figure 3 \u2013 Weibull conceptual diagram of the early failure rate <\/td>\n<\/tr>\n | ||||||
| 19<\/td>\n | Figure 4 \u2013 Example of a failure ratio: \u03b1 (in hundreds)and the number of failures for CL of 60 % <\/td>\n<\/tr>\n | ||||||
| 20<\/td>\n | 5.2.3 Screening <\/td>\n<\/tr>\n | ||||||
| 21<\/td>\n | Figure 5 \u2013 Screening and estimated early fail rate in Weibull diagram <\/td>\n<\/tr>\n | ||||||
| 22<\/td>\n | 5.3 Random failure 5.3.1 Description Figure 6 \u2013 Bathtub curve setting the point immediately after production as the origin Figure 7 \u2013 Bathtub curve setting the point after screening as the origin <\/td>\n<\/tr>\n | ||||||
| 23<\/td>\n | 5.3.2 Mean failure rate Figure 8 \u2013 Conceptual diagram of calculation method for the meanfailure rate from the exponential distribution <\/td>\n<\/tr>\n | ||||||
| 24<\/td>\n | Figure 9 \u2013 Conceptual diagram of calculation method forthe mean failure rate as an extension of early failure <\/td>\n<\/tr>\n | ||||||
| 26<\/td>\n | 5.4 Wear-out failure 5.4.1 Description 5.4.2 Wear-out failure rate Figure 10 \u2013 Conceptual diagram of the wear-out failure <\/td>\n<\/tr>\n | ||||||
| 27<\/td>\n | Figure 11 \u2013 Conceptual diagram describingthe concept of the acceleration test <\/td>\n<\/tr>\n | ||||||
| 29<\/td>\n | 6 Reliability test 6.1 Reliability test description 6.2 Reliability test plan 6.2.1 Procedures for creating a reliability test plan <\/td>\n<\/tr>\n | ||||||
| 31<\/td>\n | Figure 12 \u2013 Concept of the reliability testin a Weibull diagram (based on sample size) Table 2 \u2013 Cumulative failure probability 0,1 % over 10 years [\u00d710\u20136]for the third, fifth and seventh years <\/td>\n<\/tr>\n | ||||||
| 32<\/td>\n | 6.2.2 Estimation of the test time required to confirm the TDDB from the number of test samples <\/td>\n<\/tr>\n | ||||||
| 33<\/td>\n | 6.2.3 Estimation of the number of samples required to confirm the TDDB from the test time <\/td>\n<\/tr>\n | ||||||
| 34<\/td>\n | 6.3 Reliability test methods Figure 13 \u2013 Concept of the reliability test in a Weibull diagram (based on test time) <\/td>\n<\/tr>\n | ||||||
| 35<\/td>\n | Figure 14 \u2013 Difference in sampling sizes according to the m value (image) <\/td>\n<\/tr>\n | ||||||
| 36<\/td>\n | Table 3 \u2013 Major reliability (life) test methods and purposes <\/td>\n<\/tr>\n | ||||||
| 37<\/td>\n | Table 4 \u2013 Examples of the number of test samples and the test timein typical reliability (life) test methods <\/td>\n<\/tr>\n | ||||||
| 38<\/td>\n | 6.4 Acceleration models for reliability tests 6.4.1 Arrhenius model 6.4.2 V-model 6.4.3 Absolute water vapor pressure model 6.4.4 Coffin-Manson model <\/td>\n<\/tr>\n | ||||||
| 39<\/td>\n | 6.5 Concept of family 6.5.1 General 6.5.2 Conducting life test using family Table 5 \u2013 Concept of family (example) <\/td>\n<\/tr>\n | ||||||
| 41<\/td>\n | Table 6 \u2013 Concept of difference\/failure mechanism\/corresponding test item (examples) <\/td>\n<\/tr>\n | ||||||
| 42<\/td>\n | 6.5.3 Verification of early failure rate using family Figure 15 \u2013 How the screening defect rate is seen dependingon the difference of chip size (example) <\/td>\n<\/tr>\n | ||||||
| 43<\/td>\n | Table 7 \u2013 Factors for calculation examples of early failure rate using family data <\/td>\n<\/tr>\n | ||||||
| 44<\/td>\n | 7 Stress test methods Table 8 \u2013 LTPD sampling table for acceptance number Ac = 0 Table 9 \u2013 Major reliability (strength) test methods and purposes <\/td>\n<\/tr>\n | ||||||
| 45<\/td>\n | 8 Supplementary tests 9 Summary table of assumptions Table 10 \u2013 Supplementary tests <\/td>\n<\/tr>\n | ||||||
| 46<\/td>\n | Table 11 \u2013 Accelerating factors, calculation formulae and numerical valuesa <\/td>\n<\/tr>\n | ||||||
| 47<\/td>\n | 10 Summary <\/td>\n<\/tr>\n | ||||||
| 48<\/td>\n | Bibliography <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":" Semiconductor devices. Generic semiconductor qualification guidelines – Guidelines for IC reliability qualification<\/b><\/p>\n |