{"id":335572,"date":"2024-10-19T23:25:49","date_gmt":"2024-10-19T23:25:49","guid":{"rendered":"https:\/\/pdfstandards.shop\/product\/uncategorized\/bs-en-16602-70-102015\/"},"modified":"2024-10-25T22:23:19","modified_gmt":"2024-10-25T22:23:19","slug":"bs-en-16602-70-102015","status":"publish","type":"product","link":"https:\/\/pdfstandards.shop\/product\/publishers\/bsi\/bs-en-16602-70-102015\/","title":{"rendered":"BS EN 16602-70-10:2015"},"content":{"rendered":"

This Standard defines the requirements for evaluation, qualification and maintenance of qualification of PCB manufacturers for different types of PCBs. This Standard is applicable to the following type of PCBs: – Rigid PCBs (single-sided, double-sided, multilayer, sequential-laminated multilayer, metal core) – Flexible PCB (single-sided and double-sided) – Rigid-flex PCBs (multilayer and sequential-laminated multilayer) – High frequency PCBs – Special PCBs. PCBs are used for the mounting of components in order to produce PCB assemblies performing complex electrical functions. The PCBs are subjected to thermal and mechanical shocks during their assembly such as mounting of components by soldering, rework and repair under normal terrestrial conditions, and in addition the complex PCB assembly are subjected to the environment imposed by launch and space flights. This standard may be tailored for the specific characteristics and constraints of a space project in conformance with ECSS-S-ST-00.<\/p>\n

PDF Catalog<\/h4>\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n
PDF Pages<\/th>\nPDF Title<\/th>\n<\/tr>\n
13<\/td>\n3.1 Terms from other standards
3.2 Terms specific to the present standard <\/td>\n<\/tr>\n
16<\/td>\n3.3 Abbreviated terms <\/td>\n<\/tr>\n
18<\/td>\n4.1 General
4.2 Roles <\/td>\n<\/tr>\n
19<\/td>\n4.3 Specification of test requirements <\/td>\n<\/tr>\n
20<\/td>\n5.1 General
5.2 Request for evaluation
5.3 Evaluation PCBs <\/td>\n<\/tr>\n
21<\/td>\n5.4 Line audit <\/td>\n<\/tr>\n
22<\/td>\n6.1 General
6.2 Qualification programme definition and approval <\/td>\n<\/tr>\n
23<\/td>\n6.3 Nonconformance criteria
6.4 Qualification programme implementation <\/td>\n<\/tr>\n
27<\/td>\n6.5 Qualification PCBs
6.5.1 General <\/td>\n<\/tr>\n
29<\/td>\n6.5.2 Test pattern A: Electrical test
6.5.3 Test pattern B: Mechanical test <\/td>\n<\/tr>\n
30<\/td>\n6.5.4 Test pattern C: Electrical test
6.5.5 Test pattern D: Electrical test and visual aspect <\/td>\n<\/tr>\n
31<\/td>\n6.5.6 Test pattern E: Electrical test <\/td>\n<\/tr>\n
32<\/td>\n6.5.7 Test pattern F: Metal\ufffdplating test
6.5.8 Test pattern G: Metal\ufffdplating\/coating test <\/td>\n<\/tr>\n
33<\/td>\n6.5.9 Test pattern H: Electrical test
6.5.10 Test pattern J: Solderability test <\/td>\n<\/tr>\n
34<\/td>\n6.5.11 Test pattern K: Physical test
6.5.12 Test pattern L: Demonstration of technological capability <\/td>\n<\/tr>\n
35<\/td>\n6.5.13 Test pattern M: CAD\/CAM criteria(on request by the qualification authority) <\/td>\n<\/tr>\n
36<\/td>\n6.5.14 Test pattern X: Resistance to bending cycles (for flexible parts only)
6.5.15 Test pattern Y: Electrical test(on request by the supplier) <\/td>\n<\/tr>\n
37<\/td>\n6.5.16 Test pattern W: Electrical test for high frequency circuits (on request by the supplier)
6.6 Qualification approval
6.7 Maintenance of qualification <\/td>\n<\/tr>\n
39<\/td>\n7.1 General
7.2 Group 1 \u2014 Visual inspection and non\ufffddestructive test
7.2.1 General
7.2.2 Verification of marking <\/td>\n<\/tr>\n
40<\/td>\n7.2.3 Visual aspects <\/td>\n<\/tr>\n
43<\/td>\n7.2.4 External dimensions
7.2.5 Warp <\/td>\n<\/tr>\n
44<\/td>\n7.2.6 Twist
7.2.7 Subgroup 1.1 \u2014 Specific dimensional check <\/td>\n<\/tr>\n
46<\/td>\n7.2.8 Subgroup 1.2 \u2014 Electrical measurements
7.2.8.1 General
7.2.8.2 Intralayer insulation resistance on test pattern A
7.2.8.3 Interlayer insulation resistance on test pattern H
7.2.8.4 Dielectric withstanding voltage intralayer on test pattern A and interlayer on test pattern H <\/td>\n<\/tr>\n
47<\/td>\n7.2.8.5 Continuity on test pattern D
7.2.8.6 Interconnection resistance on test pattern E <\/td>\n<\/tr>\n
48<\/td>\n7.2.8.7 Impedance test on test pattern Y
7.2.8.8 Dielectric constant and loss tangent for high frequency materials on test pattern W
7.3 Group 2 \u2014 Miscellaneous tests
7.3.1 General
7.3.2 Subgroup 2.1 \u2014 Solderability test \u2014 Wettability on test pattern J <\/td>\n<\/tr>\n
49<\/td>\n7.3.3 Subgroup 2.2 \u2014 Mechanical tests
7.3.3.1 Peel strength on test pattern B <\/td>\n<\/tr>\n
50<\/td>\n7.3.3.2 Pull\ufffdoff strength on test pattern B
7.3.3.3 Flexural fatigue on test pattern X (only for double sided flexible PCB) <\/td>\n<\/tr>\n
51<\/td>\n7.3.3.4 Bending test (only for rigid\ufffdflex)
7.3.4 Subgroup 2.3 \u2014 Coatings tests
7.3.4.1 Coating adhesion of non\ufffdfused SnPb finishes on test pattern G <\/td>\n<\/tr>\n
52<\/td>\n7.3.4.2 Analysis of SnPb coating on test pattern G
7.3.4.3 Microsectioning on test pattern F <\/td>\n<\/tr>\n
58<\/td>\n7.3.5 Subgroup 2.4 \u2014 Electrical tests
7.3.5.1 Current overload on test pattern E <\/td>\n<\/tr>\n
59<\/td>\n7.3.5.2 Internal short circuit on test pattern C <\/td>\n<\/tr>\n
60<\/td>\n7.3.6 Subgroup 2.5 \u2014 Physical tests on test pattern K
7.3.6.1 Water absorption (optional)
7.3.6.2 Outgassing <\/td>\n<\/tr>\n
61<\/td>\n7.4 Group 3 \u2014 Thermal stress and thermal shock (on PCB)
7.4.1 General
7.4.2 Solder bath float and vapour phase reflow simulation (on board without test pattern F)
7.4.2.1 Solder bath floating test
7.4.2.2 Vapour phase simulation test <\/td>\n<\/tr>\n
62<\/td>\n7.4.3 Rework simulation (thermal shock, hand soldering) on test pattern F <\/td>\n<\/tr>\n
63<\/td>\n7.5 Group 4 \u2014 Thermal cycling (on PCB) <\/td>\n<\/tr>\n
64<\/td>\n7.6 Group 5 \u2014 Damp heat \u2014 Steam ageing (on PCB)
7.6.1 General
7.6.2 Damp heat (on entire PCB excluding test pattern F)
7.6.3 Steam ageing on test pattern F <\/td>\n<\/tr>\n
66<\/td>\n8.1 General
8.2 Data
8.3 Incoming inspection of raw materials
8.4 Traceability <\/td>\n<\/tr>\n
67<\/td>\n8.5 Calibration
8.6 Workmanship standards
8.7 Inspection
8.8 Operator and inspector training
8.9 Quality test specimen <\/td>\n<\/tr>\n
68<\/td>\n8.10 Microsection
8.11 Final inspection and tests
8.12 Delivery <\/td>\n<\/tr>\n
69<\/td>\n9.1 Rigid single\ufffdsided and double\ufffdsided PCBs <\/td>\n<\/tr>\n
71<\/td>\n9.2 Rigid single\ufffdsided and double\ufffdsided PCBs for high frequency application <\/td>\n<\/tr>\n
74<\/td>\n9.3 Flexible PCBs <\/td>\n<\/tr>\n
76<\/td>\n9.4 Rigid\ufffdflex PCBs
9.5 Rigid multilayer PCBs <\/td>\n<\/tr>\n
79<\/td>\n9.6 Sequential rigid multilayer PCBs <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":"

Space product assurance. Qualification of printed circuit boards<\/b><\/p>\n\n\n\n\n
Published By<\/td>\nPublication Date<\/td>\nNumber of Pages<\/td>\n<\/tr>\n
BSI<\/b><\/a><\/td>\n2015<\/td>\n94<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n","protected":false},"featured_media":335576,"template":"","meta":{"rank_math_lock_modified_date":false,"ep_exclude_from_search":false},"product_cat":[2641],"product_tag":[],"class_list":{"0":"post-335572","1":"product","2":"type-product","3":"status-publish","4":"has-post-thumbnail","6":"product_cat-bsi","8":"first","9":"instock","10":"sold-individually","11":"shipping-taxable","12":"purchasable","13":"product-type-simple"},"_links":{"self":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product\/335572","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/types\/product"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/media\/335576"}],"wp:attachment":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/media?parent=335572"}],"wp:term":[{"taxonomy":"product_cat","embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product_cat?post=335572"},{"taxonomy":"product_tag","embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product_tag?post=335572"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}