ISO 9453:2020
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Soft solder alloys — Chemical compositions and forms
Published By | Publication Date | Number of Pages |
ISO | 2020-09 | 20 |
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This document specifies the requirements for chemical composition for soft solder alloys containing two or more of: tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium.
An indication of the forms generally available is also included.
Published Code | ISO |
---|---|
Published By | International Organization for Standardization |
Publication Date | 2020-09 |
Pages Count | 20 |
Language | France |
Edition | 4 |
File Size | 358.4 KB |
ICS Codes | 25.160.50 - Brazing and soldering |
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