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IPC TR-462:1987

$32.50

Solderability Evaluation of Printed Boards with Protective Coatings over a Long Term Storage

Published By Publication Date Number of Pages
IPC 1987-10-01 74
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The Round Robin Test Program had the following objectives.

  • Determine the effectiveness of different protective coatings, and methods of coating application, on printed wiring boards.
  • Coatings were to be applied over a variety of conductor patterns, land configurations, plated and non-plated holes, on PWBs with and without solder mask.
  • Provide insight into PWB solderability after various time periods in typical storage conditions, and correlate this data with the thickness and characteristics of the coating.
  • Determine if various patterns of conductors, lands, spacing and configuration contributed to the soldering characteristics.
IPC TR-462:1987
$32.50