BSI PD IEC TS 62686-2:2019 – TC:2020 Edition
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Tracked Changes. Process management for avionics. Electronic components for aerospace, defence and high performance (ADHP) applications – General requirements for passive components
| Published By | Publication Date | Number of Pages |
| BSI | 2020 | 139 |
IEC TS 62686-2:2019 defines the minimum requirements for general purpose ‘off-the-shelf’ COTS (commercial off-the-shelf) passive components for aerospace, defence and high performance (ADHP) applications. This document applies to all passive components that can be operated in ADHP applications within the manufacturers’ publicly available data sheet limits in conjunction with IEC TS 62239-1. This document can be used by other high performance and high reliability industries, at their discretion. ADHP application requirements are not necessarily fulfilled by this document alone. ADHP original equipment manufacturers (OEMs) could consider redesigning their products or conducting further testing to verify suitability in ADHP applications using their procedures for satisfying their electronic component management plan (ECMP) (see IEC TS 62239-1). This first edition cancels and replaces IEC PAS 62686-2 published in 2016.
PDF Catalog
| PDF Pages | PDF Title |
|---|---|
| 79 | undefined |
| 81 | CONTENTS |
| 84 | FOREWORD |
| 86 | INTRODUCTION |
| 87 | 1 Scope 2 Normative references 3 Terms, definitions and abbreviated terms 3.1 Terms and definitions |
| 90 | 3.2 Abbreviated terms |
| 91 | 4 Technical requirements 4.1 General 4.1.1 Overview |
| 92 | 4.1.2 Equivalent methods 4.2 Procedures 4.2.1 General |
| 93 | 4.2.2 Product discontinuance 4.2.3 ESD protection during manufacture 4.2.4 Traceability 4.3 Shipment controls 4.3.1 General 4.3.2 Unit pack container 4.3.3 Intermediate packing |
| 94 | 4.3.4 Date codes 4.3.5 Moisture sensitivity level (MSL) 4.3.6 Lead-free marking 4.3.7 Labels |
| 95 | 4.3.8 Electrostatic discharge (ESD) 4.4 Product or process change notification (PCN) 4.4.1 General Tables Table 1 – Label requirements |
| 96 | 4.4.2 Notification 4.4.3 Notification details 4.5 Electrical 4.5.1 General 4.5.2 Electrical test 4.6 Mechanical 4.6.1 General |
| 97 | 4.6.2 Device marking 4.6.3 Lead-free components 4.6.4 Moisture sensitivity 4.6.5 Termination finishes |
| 98 | 4.6.6 Termination finish notification of change 4.7 Audit capability 4.7.1 General 4.7.2 Internal quality audits 4.7.3 Subcontract manufacturing 4.8 Quality assurance 4.8.1 General Table 2 – Internal quality audit areas |
| 99 | 4.8.2 Quality system 4.8.3 Sampling plans 4.8.4 Failure analysis support 4.8.5 Outgoing quality 4.9 Qualification 4.9.1 General |
| 100 | 4.9.2 Methodology |
| 101 | Table 3 – Technology/family qualification and device qualification |
| 102 | Table 4 – Qualification tests for device types |
| 103 | 4.9.3 Test samples 4.9.4 Qualification categories 4.9.5 Maintenance of qualification standard |
| 104 | 4.9.6 In-process test results 4.9.7 Test references 4.9.8 Qualification report 4.9.9 Archiving 4.9.10 Qualification of device changes 4.9.11 Similarity assessment |
| 105 | 4.10 Product monitoring in the production line 4.10.1 General 4.10.2 Monitoring programme 4.10.3 Problem notification 4.10.4 Data reporting 4.11 Environmental health and safety (EHS) 4.11.1 General |
| 106 | 4.11.2 General EHS compliance 4.11.3 Device handling 4.11.4 Device materials and substances |
| 107 | Annex A (informative)Test code (TC) information for guidance A.1 General A.2 TC1 – Electrical test A.3 TC2 – External visual |
| 108 | A.4 TC3 – Package dimensions |
| 109 | A.5 TC4 – High temperature exposure (storage) A.6 TC5 – Temperature cycling A.7 TC6 – Moisture resistance A.8 TC7 – Biased humidity A.9 TC8 – High temperature operating life |
| 110 | A.10 TC9 – Terminal strength (leaded) A.11 TC10-Resistance to solvents A.12 TC11 – Mechanical shock A.13 TC12 – Vibration A.14 TC13 – Resistance to heat |
| 111 | A.15 TC14 – Thermal shock A.16 TC15 – Board flex (SMD) A.17 TC16 – Beam load A.18 TC17 – Solderability A.19 TC18 – Electrostatic discharge A.20 TC19 – Flammability A.21 TC20 – Terminal strength (SMD) A.22 TC21 – Surge voltage |
| 112 | A.23 TC22 – Hermeticity A.24 TC23 – Tin whisker |
| 113 | Annex B (informative)Typical IECQ-CECC approved components |
| 115 | Annex C (informative)Typical USA military specified passive components |
| 116 | Annex D (informative)Typical automotive components Table D.1 – AEC-Q200 temperature grades |
| 118 | Annex E (informative)Typical IEC specified passive components E.1 Typical IEC passive component specifications E.2 IEC passive component environmental test methods |
| 119 | Table E.1 – IEC passive specifications’ environmental test methods compared to those specified in Table 3 |
| 125 | Annex F (informative)Verification requirements matrix for IEC TS 62686-2 Table F.1 – Verification requirements matrix for IEC TS 62686-2 |
| 134 | Bibliography |
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