BSI 18/30380157 DC:2019 Edition
$13.70
BS IEC 61189-5-601. Test methods for electrical materials, printed boards and other interconnection structures and assemblies. – Part 5-601. General test methods for materials and assemblies. Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards
| Published By | Publication Date | Number of Pages |
| BSI | 2019 | 34 |
| Status | Definitive |
|---|---|
| Pages | 34 |
| Publication Date | 2019-09-13 |
| Standard Number | 18/30380157 DC |
| Title | BS IEC 61189-5-601. Test methods for electrical materials, printed boards and other interconnection structures and assemblies. – Part 5-601. General test methods for materials and assemblies. Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards |
| Identical National Standard Of | IEC 61189-5-601 Ed1.0 |
| Descriptors | Printing board, Heat resistance, Resistance (electrical), Testing, Electrical equipment |
| Publisher | BSI |
| Committee | EPL/501 |
| ICS Codes | 19.080 - Electrical and electronic testing |
