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BS EN 62435-5:2017

BS EN 62435-5:2017

$142.49

Electronic components. Long-term storage of electronic semiconductor devices – Die and wafer devices

Published By Publication Date Number of Pages
BSI 2017 26
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This part of IEC 62435, is applicable to long-term storage of die and wafer devices and establishes specific storage regimen and conditions for singulated bare die and partial or complete wafers of die including die with added structures such as redistribution layers and solder balls or bumps or other metallisation. This part also provides guidelines for special requirements and primary packaging that contain the die or wafers for handling purposes. Typically, this part is used in conjunction with IEC 62435-1 for long-term storage of devices whose duration can be more than 12 months for products scheduled for long duration storage.

PDF Catalog

PDF Pages PDF Title
6 English
CONTENTS
8 FOREWORD
10 INTRODUCTION
12 1 Scope
2 Normative references
3 Terms, definitions and abbreviated terms
3.1 Terms and definitions
13 3.2 Abbreviations
4 Storage requirements
4.1 General
4.2 Assembly data
4.3 Prerequisite for storage
4.4 Damage to die products during long-term storage
14 4.5 Mechanical storage conditions
4.6 Long-term storage environment
15 4.7 Recommended inert atmosphere purity
4.8 Chemical contamination
4.9 Vacuum packing
4.9.1 General
4.9.2 Vacuum dry pack
4.10 Positive pressure systems for packing
4.11 Use of packing material having sacrificial properties
16 4.12 Use of bio-degradable material
4.13 Plasma cleaning
4.14 Electrical effects
4.15 Protection from radiation
4.16 Periodic qualification of stored die products
17 5 Long-term storage failure mechanisms
6 LTS concerns, method, verification and limitations
6.1 General
6.2 Wafers
18 6.3 Bare dice
Table 1 – LTS exposure concerns for wafers
19 7 Deterioration mechanisms specific to bare die and wafers
7.1 Wire bondability
7.2 Staining
Table 2 – LTS exposure concerns for bare dice
20 7.3 Topside delamination
8 Specific handling concerns
8.1 Die on wafer film frames
8.2 Devices and dice embossed or punched tape storage
8.3 Handling damage
21 Annex A (informative) Audit checklist
Table A.1 – Planning checklist (1 of 3)
24 Bibliography

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BS EN 62435-5:2017
$142.49