BS EN 61760-2:2007

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Surface mounting technology – Transportation and storage conditions of surface mounting devices (SMD). Application guide

Published By	Publication Date	Number of Pages
BSI	2007	12

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Description

IEC 61760-2:2007 describes the transportation and storage conditions for surface mounting devices (SMDs) that are fulfilled in order to enable trouble-free processing of surface mounting devices, both active and passive (Conditions for printed boards are not taken into consideration). The object of this standard is to ensure that users of SMDs receive and store products that can be further processed (e.g. positioned, soldered) without prejudice to quality and reliability. Improper transportation and storage of SMDs may cause deterioration and result in assembly problems such as poor solderability, delamination and “popcorning”. This second edition cancels and replaces the first edition, published in 1998, and constitutes a technical revision. The standard was updated and editorially revised.

Additional information

Status	Withdrawn
Title	Surface mounting technology – Transportation and storage conditions of surface mounting devices (SMD). Application guide
Replaces	BS EN 61760-2:1998
Publisher	BSI
Committee	EPL/501
Pages	12
Publication Date	2007-07-31
Withdrawn Date	2021-09-10
Replaced By	BS EN IEC 61760-2:2021
ISBN	978 0 580 56232 7
Standard Number	BS EN 61760-2:2007
Identical National Standard Of	IEC 61760-2:2007, EN 62148-1:2002, EN 61760-2:2007
Descriptors	Integrated circuit technology, Electrical components, Environment (working), Safety measures, Storage, Rail transport, Transportation, Integrated circuits, Surface mounting devices, Electronic equipment and components, Road transport, Packaging, Air transport
ICS Codes	31.240 - Mechanical structures for electronic equipment

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BS EN 61760-2:2007

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