BS EN 60191-6-18:2010

$142.49

Mechanical standardization of semiconductor devices – General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for ball grid array (BGA)

Published By	Publication Date	Number of Pages
BSI	2010	24

Guaranteed Safe Checkout

Categories: 31.080.01 - Semiconductor devices in general, BSI

If you have any questions, feel free to reach out to our online customer service team by clicking on the bottom right corner. We’re here to assist you 24/7.
Email:[email protected]

Description

This part of IEC 60191 provides standard outline drawings, dimensions, and recommended variations for all square ball grid array packages (BGA), whose terminal pitch is 1 mm or larger.

Additional information

Status	Definitive
Pages	24
Publication Date	2010-10-31
ISBN	978 0 580 71947 9
Standard Number	BS EN 60191-6-18:2010
Title	Mechanical standardization of semiconductor devices – General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for ball grid array (BGA)
Identical National Standard Of	IEC 60191-6-18:2010/COR1:2010, IEC 60191-6-18:2010/COR1:2010
Corrects	BS EN 60191-6-18:2010, BS IEC 60191-2:1966+A21:2020
Descriptors	Dimensions, Standardization, Interchangeability, Designations, Drawings, Technical drawing, Integrated circuits, Surface mounting devices, Packages, Design, Engineering drawings, Semiconductor devices, Electronic equipment and components
Publisher	BSI
Committee	EPL/47
ICS Codes	31.080.01 - Semiconductor devices in general

Preview PDF


PDF Format	Searchable	Printable	Preview Now

BS EN 60191-6-18:2010

Related products