BS EN 60191-6-18:2010
$142.49
Mechanical standardization of semiconductor devices – General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for ball grid array (BGA)
Published By | Publication Date | Number of Pages |
BSI | 2010 | 24 |
This part of IEC 60191 provides standard outline drawings, dimensions, and recommended variations for all square ball grid array packages (BGA), whose terminal pitch is 1 mm or larger.