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BS EN 60191-6-18:2010

$142.49

Mechanical standardization of semiconductor devices – General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for ball grid array (BGA)

Published By Publication Date Number of Pages
BSI 2010 24
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This part of IEC 60191 provides standard outline drawings, dimensions, and recommended variations for all square ball grid array packages (BGA), whose terminal pitch is 1 mm or larger.

BS EN 60191-6-18:2010
$142.49