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BS EN 16602-70-10:2015

BS EN 16602-70-10:2015

$215.11

Space product assurance. Qualification of printed circuit boards

Published By Publication Date Number of Pages
BSI 2015 94
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This Standard defines the requirements for evaluation, qualification and maintenance of qualification of PCB manufacturers for different types of PCBs. This Standard is applicable to the following type of PCBs: – Rigid PCBs (single-sided, double-sided, multilayer, sequential-laminated multilayer, metal core) – Flexible PCB (single-sided and double-sided) – Rigid-flex PCBs (multilayer and sequential-laminated multilayer) – High frequency PCBs – Special PCBs. PCBs are used for the mounting of components in order to produce PCB assemblies performing complex electrical functions. The PCBs are subjected to thermal and mechanical shocks during their assembly such as mounting of components by soldering, rework and repair under normal terrestrial conditions, and in addition the complex PCB assembly are subjected to the environment imposed by launch and space flights. This standard may be tailored for the specific characteristics and constraints of a space project in conformance with ECSS-S-ST-00.

PDF Catalog

PDF Pages PDF Title
13 3.1 Terms from other standards
3.2 Terms specific to the present standard
16 3.3 Abbreviated terms
18 4.1 General
4.2 Roles
19 4.3 Specification of test requirements
20 5.1 General
5.2 Request for evaluation
5.3 Evaluation PCBs
21 5.4 Line audit
22 6.1 General
6.2 Qualification programme definition and approval
23 6.3 Nonconformance criteria
6.4 Qualification programme implementation
27 6.5 Qualification PCBs
6.5.1 General
29 6.5.2 Test pattern A: Electrical test
6.5.3 Test pattern B: Mechanical test
30 6.5.4 Test pattern C: Electrical test
6.5.5 Test pattern D: Electrical test and visual aspect
31 6.5.6 Test pattern E: Electrical test
32 6.5.7 Test pattern F: Metal�plating test
6.5.8 Test pattern G: Metal�plating/coating test
33 6.5.9 Test pattern H: Electrical test
6.5.10 Test pattern J: Solderability test
34 6.5.11 Test pattern K: Physical test
6.5.12 Test pattern L: Demonstration of technological capability
35 6.5.13 Test pattern M: CAD/CAM criteria(on request by the qualification authority)
36 6.5.14 Test pattern X: Resistance to bending cycles (for flexible parts only)
6.5.15 Test pattern Y: Electrical test(on request by the supplier)
37 6.5.16 Test pattern W: Electrical test for high frequency circuits (on request by the supplier)
6.6 Qualification approval
6.7 Maintenance of qualification
39 7.1 General
7.2 Group 1 — Visual inspection and non�destructive test
7.2.1 General
7.2.2 Verification of marking
40 7.2.3 Visual aspects
43 7.2.4 External dimensions
7.2.5 Warp
44 7.2.6 Twist
7.2.7 Subgroup 1.1 — Specific dimensional check
46 7.2.8 Subgroup 1.2 — Electrical measurements
7.2.8.1 General
7.2.8.2 Intralayer insulation resistance on test pattern A
7.2.8.3 Interlayer insulation resistance on test pattern H
7.2.8.4 Dielectric withstanding voltage intralayer on test pattern A and interlayer on test pattern H
47 7.2.8.5 Continuity on test pattern D
7.2.8.6 Interconnection resistance on test pattern E
48 7.2.8.7 Impedance test on test pattern Y
7.2.8.8 Dielectric constant and loss tangent for high frequency materials on test pattern W
7.3 Group 2 — Miscellaneous tests
7.3.1 General
7.3.2 Subgroup 2.1 — Solderability test — Wettability on test pattern J
49 7.3.3 Subgroup 2.2 — Mechanical tests
7.3.3.1 Peel strength on test pattern B
50 7.3.3.2 Pull�off strength on test pattern B
7.3.3.3 Flexural fatigue on test pattern X (only for double sided flexible PCB)
51 7.3.3.4 Bending test (only for rigid�flex)
7.3.4 Subgroup 2.3 — Coatings tests
7.3.4.1 Coating adhesion of non�fused SnPb finishes on test pattern G
52 7.3.4.2 Analysis of SnPb coating on test pattern G
7.3.4.3 Microsectioning on test pattern F
58 7.3.5 Subgroup 2.4 — Electrical tests
7.3.5.1 Current overload on test pattern E
59 7.3.5.2 Internal short circuit on test pattern C
60 7.3.6 Subgroup 2.5 — Physical tests on test pattern K
7.3.6.1 Water absorption (optional)
7.3.6.2 Outgassing
61 7.4 Group 3 — Thermal stress and thermal shock (on PCB)
7.4.1 General
7.4.2 Solder bath float and vapour phase reflow simulation (on board without test pattern F)
7.4.2.1 Solder bath floating test
7.4.2.2 Vapour phase simulation test
62 7.4.3 Rework simulation (thermal shock, hand soldering) on test pattern F
63 7.5 Group 4 — Thermal cycling (on PCB)
64 7.6 Group 5 — Damp heat — Steam ageing (on PCB)
7.6.1 General
7.6.2 Damp heat (on entire PCB excluding test pattern F)
7.6.3 Steam ageing on test pattern F
66 8.1 General
8.2 Data
8.3 Incoming inspection of raw materials
8.4 Traceability
67 8.5 Calibration
8.6 Workmanship standards
8.7 Inspection
8.8 Operator and inspector training
8.9 Quality test specimen
68 8.10 Microsection
8.11 Final inspection and tests
8.12 Delivery
69 9.1 Rigid single�sided and double�sided PCBs
71 9.2 Rigid single�sided and double�sided PCBs for high frequency application
74 9.3 Flexible PCBs
76 9.4 Rigid�flex PCBs
9.5 Rigid multilayer PCBs
79 9.6 Sequential rigid multilayer PCBs

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BS EN 16602-70-10:2015
$215.11