BS CECC 23700-801:1998
$102.76
Harmonized system of quality assessment for electronic components. Capability detail specification: flex-rigid double-sided printed boards with through connections
| Published By | Publication Date | Number of Pages |
| BSI | 1998 | 22 |
| Status | Definitive |
|---|---|
| Pages | 22 |
| Publication Date | 1998-06-15 |
| ISBN | 0 580 29894 9 |
| Standard Number | BS CECC 23700-801:1998 |
| Title | Harmonized system of quality assessment for electronic components. Capability detail specification: flex-rigid double-sided printed boards with through connections |
| Identical National Standard Of | CECC 23700-801:1998 |
| Descriptors | Finishes, Electrical insulation, Organic coatings, Detail specification, Performance, Solderability testing, Electronic equipment and components, Specification (approval), Ageing tests, Resistance measurement, Electrical testing, Testing conditions, Printed-circuit boards, Printed circuits, Designations, Test specimens, Acceptance (approval), Edge, Approval testing, Assessed quality, Electric conductors, Visual inspection (testing), Metals, Quality assurance systems, Electric connectors, Qualification approval, Electric contacts, Capability approval, Holes, Electrical equipment, Electrical components, Defects, Mechanical testing |
| Publisher | BSI |
| Committee | EPL/501 |
| ICS Codes | 31.180 - Printed circuits and boards |
