BS CECC 23600-801:1998
$142.49
Harmonized system of quality assessment for electronic components. Capability detail specification: flex-rigid multilayer printed boards with through connections
| Published By | Publication Date | Number of Pages |
| BSI | 1998 | 24 |
| Status | Definitive |
|---|---|
| Pages | 24 |
| Publication Date | 1998-06-15 |
| ISBN | 0 580 29890 6 |
| Standard Number | BS CECC 23600-801:1998 |
| Title | Harmonized system of quality assessment for electronic components. Capability detail specification: flex-rigid multilayer printed boards with through connections |
| Identical National Standard Of | CECC 23600-801:1998 |
| Descriptors | Conformity, Approval testing, Electronic equipment and components, Detail specification, Porosity measurement, Electrical components, Organic coatings, Electrical testing, Designations, Metal coatings, Edge socket connectors, Finishes, Preferred sizes, Solderability testing, Assessed quality, Electrical equipment, Laminates, Dimensional measurement, Inspection, Visual inspection (testing), Quality assurance systems, Surface treatment, Specification (approval), Thickness, Electrical insulation, Printed circuits, Holes, Printed-circuit boards, Defects, Mechanical testing, Multiple, Contaminants, Acceptance (approval), Ageing tests, Bonding, Resistance measurement, Specimen preparation, Capability approval |
| Publisher | BSI |
| Committee | EPL/501 |
| ICS Codes | 31.180 - Printed circuits and boards |
