AS 60068.2.58:2004
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Environmental testing – Tests – Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
| Published By | Publication Date | Number of Pages |
| AS | 2004-08-10 | 24 |
The ASĀ 60068 Standards include a series of environmental testing procedures, information on the severity of tests, and information on atmospheric conditions for measurement and testing. Although primarily intended for electrotechnical products, many of the procedures are equally applicable to other industrial products
Scope
This part of IEC 60068 outlines test Td, applicable to surface mounting devices (SMD). Soldering tests applicable to SMD in IEC 60068-2-69 and to other electrotechnical products are in IEC 60068-2-20 and IEC 60068-2-54, for which guidance is given in IEC 60068-2-44.
This standard provides standard procedures for determining the solderabillty, resistance to dissolution of metallization and resistance to soldering heat of surface mounting devices (SMD) (hereinafter referred to as specimens).
The procedures use either a solder bath or reflow method and are applicable only to specimens or products designed to withstand short term immersion in molten solder or limited exposure to reflow systems.
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