UNE-EN 60191-6-4:2003
$21.45
Mechanical standardization of semiconductor devices — Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Measuring methods for package dimensions of ball grid array (BGA)
| Published By | Publication Date | Number of Pages |
| AENOR | 2003-10-01 | 20 |
| Published Code | AENOR |
|---|---|
| Published By | Asociación Española de Normalización |
| Publication Date | 2003-10-01 |
| Pages Count | 20 |
| Language | English |
| File Size | 348.2 KB |
| ICS Codes | 31.080.01 - Semiconductor devices in general |
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