{"id":641445,"date":"2024-11-06T01:23:00","date_gmt":"2024-11-06T01:23:00","guid":{"rendered":"https:\/\/pdfstandards.shop\/product\/uncategorized\/iso-ts-10303-16502006\/"},"modified":"2024-11-06T01:23:00","modified_gmt":"2024-11-06T01:23:00","slug":"iso-ts-10303-16502006","status":"publish","type":"product","link":"https:\/\/pdfstandards.shop\/product\/publishers\/iso\/iso-ts-10303-16502006\/","title":{"rendered":"ISO\/TS 10303-1650:2006"},"content":{"rendered":"

ISO\/TS 10303-1650:2006 specifies the application module for
\n Bare die. <\/p>\n

ISO\/TS 10303-1650:2006 deals with the
\n representation of the information needed to describe a semiconductor material product
\n \t that is an integrated circuit component, or that may be a discrete active component,
\n \t or that may be included as a component in an electronic assembly.
\n \t Terminal information is supported, including explicit shape data.
\n \t A bare die usually refers to semiconductor substrates that are traditionally considered protected by a container, called
\n a package.<\/p>\n

\n The following is within the scope of
\n ISO\/TS 10303-1650:2006:<\/p>\n