{"id":435327,"date":"2024-10-20T07:49:01","date_gmt":"2024-10-20T07:49:01","guid":{"rendered":"https:\/\/pdfstandards.shop\/product\/uncategorized\/bsi-23-30473669-dc-2023\/"},"modified":"2024-10-26T14:48:36","modified_gmt":"2024-10-26T14:48:36","slug":"bsi-23-30473669-dc-2023","status":"publish","type":"product","link":"https:\/\/pdfstandards.shop\/product\/publishers\/bsi\/bsi-23-30473669-dc-2023\/","title":{"rendered":"BSI 23\/30473669 DC 2023"},"content":{"rendered":"

PDF Catalog<\/h4>\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n
PDF Pages<\/th>\nPDF Title<\/th>\n<\/tr>\n
3<\/td>\nHORIZONTAL_STD
FUNCTION_EMC
FUNCTION_ENV
FUNCTION_QUA
FUNCTION_SAFETY <\/td>\n<\/tr>\n
4<\/td>\nCONTENTS <\/td>\n<\/tr>\n
9<\/td>\nScope
Normative references <\/td>\n<\/tr>\n
10<\/td>\nTerms, definitions and abbreviations
3.1 Terms and definitions <\/td>\n<\/tr>\n
12<\/td>\n3.2 Abbreviations <\/td>\n<\/tr>\n
13<\/td>\nConformance <\/td>\n<\/tr>\n
14<\/td>\nOverview of bonding networks <\/td>\n<\/tr>\n
15<\/td>\nSelection of the telecommunications bonding network approach
6.1 Assessment of the impact of the telecommunications bonding network on the interconnection of telecommunications equipment <\/td>\n<\/tr>\n
17<\/td>\n6.2 Telecommunications bonding networks
6.3 Telecommunications bonding network performance
6.3.1 General
6.3.1.1 Protective bonding networks <\/td>\n<\/tr>\n
18<\/td>\n6.3.1.2 Dedicated telecommunications bonding networks
6.3.2 Requirements
6.3.2.1 General requirements
6.3.2.2 Protective bonding networks <\/td>\n<\/tr>\n
19<\/td>\n6.3.2.3 Dedicated bonding networks
6.3.3 DC resistance measurements
6.3.3.1 General <\/td>\n<\/tr>\n
20<\/td>\n6.3.3.2 Dedicated bonding networks
Common features
7.1 General
7.2 Protective bonding networks
7.2.1 Protective bonding network conductors (PBNCs)
7.2.2 Main earthing terminal (MET)
7.3 Telecommunications entrance facility (TEF) <\/td>\n<\/tr>\n
21<\/td>\n7.4 Telecommunications bonding network components
7.4.1 Telecommunications bonding network conductors
7.4.1.1 Materials
7.4.1.2 Installation
7.4.2 Telecommunications bonding network connections <\/td>\n<\/tr>\n
22<\/td>\n7.5 Cabinets, frames and racks
7.5.1 External connections to a bonding network
7.5.1.1 Requirements
7.5.1.2 Recommendations <\/td>\n<\/tr>\n
23<\/td>\n7.5.2 Rack bonding conductors
7.5.2.1 Rack bonding conductors for d.c. resistance control
7.5.2.2 Rack bonding conductors (RBC) for impedance control
7.5.2.2.1 Requirements
7.5.2.2.2 Recommendations
7.5.3 Internal connections
7.5.3.1 Requirements
OLE_LINK1
OLE_LINK2 <\/td>\n<\/tr>\n
24<\/td>\n7.5.3.2 Structural bonding within cabinets, frames and racks <\/td>\n<\/tr>\n
25<\/td>\n7.6 Miscellaneous bonding connections
7.6.1 General
7.6.2 Bonding conductors for d.c. resistance control
7.6.3 Bonding conductors for impedance control
7.6.3.1 Requirements
7.6.3.2 Recommendations
7.7 Documentation <\/td>\n<\/tr>\n
26<\/td>\nDedicated telecommunications bonding network
8.1 General <\/td>\n<\/tr>\n
27<\/td>\n8.2 Components
8.2.1 Primary bonding busbar (PBB)
8.2.2 Secondary bonding busbar (SBB) <\/td>\n<\/tr>\n
28<\/td>\n8.2.3 Bonding conductors for d.c. resistance control
8.2.3.1 Telecommunications bonding conductor (TBC)
8.2.3.2 Telecommunications bonding backbone (TBB)
8.2.3.2.1 Requirements
8.2.3.2.2 Recommendations <\/td>\n<\/tr>\n
29<\/td>\n8.2.3.3 Backbone bonding conductor (BBC)
8.2.4 Bonding conductors for impedance control
8.2.4.1 Telecommunications bonding backbone (TBB)
8.2.4.1.1 Requirements
8.2.4.1.2 Recommendations
8.2.4.2 Backbone bonding conductor (BBC)
8.2.4.2.1 Requirements
8.2.4.2.2 Recommendations
8.3 Implementation
8.3.1 Primary bonding busbar (PBB)
8.3.1.1 General <\/td>\n<\/tr>\n
30<\/td>\n8.3.1.2 Bonding to the PBB
8.3.2 Secondary bonding busbar (SBB)
8.3.2.1 General
8.3.2.2 Bonding to the secondary bonding busbar <\/td>\n<\/tr>\n
31<\/td>\n8.3.3 Telecommunications bonding conductor (TBC)
8.3.4 Telecommunications bonding backbone (TBB) <\/td>\n<\/tr>\n
32<\/td>\n8.3.5 Backbone bonding conductor (BBC)
8.3.6 Bonds to continuous conductive pathway systems
8.3.7 Bonds to structural metal
Local telecommunications bonding networks in conjunction with protective bonding networks
9.1 Bonding for local distribution
9.1.1 Star protective bonding networks <\/td>\n<\/tr>\n
34<\/td>\n9.1.2 Ring protective bonding networks <\/td>\n<\/tr>\n
35<\/td>\n9.2 Telecommunications bonding conductors
9.2.1 Bonding conductors for d.c. resistance control
9.2.1.1 Requirements
9.2.1.2 Recommendations
9.2.2 Bonding conductors for impedance control
9.2.2.1 Requirements
9.2.2.2 Recommendations <\/td>\n<\/tr>\n
36<\/td>\n9.3 Bonding for areas of telecommunications equipment concentration
Local telecommunications bonding networks in conjunction with dedicated telecommunications bonding networks
10.1 Bonding for areas of telecommunications equipment concentration
10.1.1 Requirements
10.1.2 Recommendations
10.1.3 Cabinets, frames and racks
10.2 Telecommunications equipment bonding conductors (TEBC)
10.2.1 TEBC for d.c. resistance control <\/td>\n<\/tr>\n
37<\/td>\n10.2.2 TEBC for impedance control
10.2.2.1 Requirements
10.2.2.2 Recommendations
10.2.3 Implementation
Mesh bonded networks
11.1 General <\/td>\n<\/tr>\n
38<\/td>\n11.2 Mesh bonding alternatives
11.2.1 Local mesh bonding (MESH-IBN) networks
11.2.1.1 General <\/td>\n<\/tr>\n
39<\/td>\n11.2.1.2 Requirements <\/td>\n<\/tr>\n
40<\/td>\n11.2.1.3 Recommendations
11.2.2 MESH-BN
11.2.2.1 General
11.2.2.2 Requirements <\/td>\n<\/tr>\n
41<\/td>\n11.3 Bonding conductors of a mesh bonding network
11.3.1 Requirements
11.3.2 Recommendations
11.4 Bonding conductors to the mesh bonding network <\/td>\n<\/tr>\n
42<\/td>\n11.5 Supplementary bonding grid (SBG)
11.6 System reference potential plane (SRPP)
11.6.1 General <\/td>\n<\/tr>\n
43<\/td>\n11.6.2 Access floors
11.6.2.1 Requirements
11.6.2.2 Recommendations <\/td>\n<\/tr>\n
44<\/td>\n11.6.3 Transient suppression plate (TSP) <\/td>\n<\/tr>\n
45<\/td>\nAnnex\u00a0A (normative)Maintenance of telecommunications bonding network performance
A.1 General
A.2 Periodic activity
A.2.1 Schedule
A.2.2 Implementation
A.2.2.1 Protective bonding network
A.2.2.2 Dedicated bonding network
A.2.2.3 Assessment of results
A.3 Causes of performance deterioration
A.3.1 Galvanic corrosion <\/td>\n<\/tr>\n
46<\/td>\nA.3.2 Requirements <\/td>\n<\/tr>\n
47<\/td>\nAnnex\u00a0B (normative)Bonding conductor cross-sectional area <\/td>\n<\/tr>\n
48<\/td>\nAnnex\u00a0C (infomative)Alternative terminology <\/td>\n<\/tr>\n
49<\/td>\nBibliography <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":"

BS ISO\/IEC 30129 AMD 2. Information technology. Telecommunications bonding networks for buildings and other structures<\/b><\/p>\n\n\n\n\n
Published By<\/td>\nPublication Date<\/td>\nNumber of Pages<\/td>\n<\/tr>\n
BSI<\/b><\/a><\/td>\n2023<\/td>\n50<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n","protected":false},"featured_media":435336,"template":"","meta":{"rank_math_lock_modified_date":false,"ep_exclude_from_search":false},"product_cat":[2641],"product_tag":[],"class_list":{"0":"post-435327","1":"product","2":"type-product","3":"status-publish","4":"has-post-thumbnail","6":"product_cat-bsi","8":"first","9":"instock","10":"sold-individually","11":"shipping-taxable","12":"purchasable","13":"product-type-simple"},"_links":{"self":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product\/435327","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/types\/product"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/media\/435336"}],"wp:attachment":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/media?parent=435327"}],"wp:term":[{"taxonomy":"product_cat","embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product_cat?post=435327"},{"taxonomy":"product_tag","embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product_tag?post=435327"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}