{"id":236654,"date":"2024-10-19T15:26:57","date_gmt":"2024-10-19T15:26:57","guid":{"rendered":"https:\/\/pdfstandards.shop\/product\/uncategorized\/bs-en-60068-3-132016\/"},"modified":"2024-10-25T10:04:24","modified_gmt":"2024-10-25T10:04:24","slug":"bs-en-60068-3-132016","status":"publish","type":"product","link":"https:\/\/pdfstandards.shop\/product\/publishers\/bsi\/bs-en-60068-3-132016\/","title":{"rendered":"BS EN 60068-3-13:2016"},"content":{"rendered":"
This part of IEC 60068<\/span> <\/span> provides background information and guidance for writers and users of specifications for electric and electronic components, containing references to the test standards IEC 60068\u20112\u201120<\/span> <\/span>, IEC 60068\u20112\u201158<\/span> <\/span>, IEC 60068\u20112\u201169<\/span> <\/span>, IEC 60068\u20112\u201183<\/span> <\/span>, and to IEC 61760\u20111<\/span> <\/span>, which defines requirements to the specification of surface mounting components.<\/p>\n Environmental testing – Supporting documentation and guidance on Test T. Soldering<\/b><\/p>\nPDF Catalog<\/h4>\n
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\n PDF Pages<\/th>\n PDF Title<\/th>\n<\/tr>\n \n 6<\/td>\n English
CONTENTS <\/td>\n<\/tr>\n\n 8<\/td>\n FOREWORD <\/td>\n<\/tr>\n \n 10<\/td>\n 1 Scope
2 Normative references
3 Terms, definitions and abbreviations
3.1 Terms and definitions <\/td>\n<\/tr>\n\n 11<\/td>\n 3.2 Abbreviations
4 Overview
4.1 Factors influencing the formation and reliability of solder joints (ability to be soldered) <\/td>\n<\/tr>\n\n 12<\/td>\n 4.2 Physics of surface wetting
Figures
Figure 1 \u2013 Sessile drop of solder on oxidised copper <\/td>\n<\/tr>\n\n 13<\/td>\n Figure 2 \u2013 Sessile drop of solder plus flux on clean copper
Figure 3 \u2013 Sessile drop equilibrium forces <\/td>\n<\/tr>\n\n 14<\/td>\n 4.3 Quality and reliability of solder joints
5 Component soldering \u2013 Processes
5.1 General considerations
5.1.1 Components’ ability to be soldered <\/td>\n<\/tr>\n\n 16<\/td>\n 5.1.2 Soldering processes
5.1.3 Soldering defects
5.1.4 Geometrical factors which may influence the soldering result
5.1.5 Process factors
5.1.6 Material factors
Figure 4 \u2013 Typical soldering processes <\/td>\n<\/tr>\n\n 17<\/td>\n 5.2 Solder
5.3 Grouping of soldering conditions
5.4 Ability to be soldered
5.5 Moisture sensitivity of components
Tables
Table 1 \u2013 Solder process groups <\/td>\n<\/tr>\n\n 18<\/td>\n 5.6 Relation between storage time\/storage conditions and solderability
5.6.1 Natural and accelerated ageing
5.6.2 Oxidation
5.6.3 Growth of intermetallic layers
5.6.4 Effect of ageing to wetting characteristics <\/td>\n<\/tr>\n\n 19<\/td>\n 5.6.5 Test conditions for accelerated ageing <\/td>\n<\/tr>\n \n 20<\/td>\n 5.7 Place of soldering tests in testing <\/td>\n<\/tr>\n \n 21<\/td>\n 6 Soldering tests
6.1 General <\/td>\n<\/tr>\n\n 22<\/td>\n 6.2 Solder
6.3 Fluxes
6.4 Test equipment
6.5 Evaluation methods
6.5.1 Criteria for visual inspection <\/td>\n<\/tr>\n\n 23<\/td>\n 6.5.2 Criteria for quantitative evaluation of the wetting characteristic
6.5.3 Special cases
6.6 Acceptance criteria
7 Soldering tests \u2013 Methods
7.1 General principles
7.2 Survey of test methods <\/td>\n<\/tr>\n\n 25<\/td>\n Figure 5 \u2013 Soldering tests for devices with leads <\/td>\n<\/tr>\n \n 26<\/td>\n 7.3 Bath test
Figure 6 \u2013 Soldering tests for SMDs <\/td>\n<\/tr>\n\n 27<\/td>\n 7.4 Reflow test
7.4.1 With\/without solder land
7.4.2 Selection of solder paste (flux system and activity grade)
7.5 Soldering iron test
7.6 Resistance to dissolution of metallization and soldering heat
7.6.1 General
7.6.2 Limitations <\/td>\n<\/tr>\n\n 28<\/td>\n 7.6.3 Choice of severity
7.7 Wetting balance test
7.7.1 General <\/td>\n<\/tr>\n\n 29<\/td>\n 7.7.2 Test methods available
7.7.3 Limitations
8 Requirements and statistical character of results <\/td>\n<\/tr>\n\n 31<\/td>\n Bibliography <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":" \n\n
\n Published By<\/td>\n Publication Date<\/td>\n Number of Pages<\/td>\n<\/tr>\n \n BSI<\/b><\/a><\/td>\n 2016<\/td>\n 34<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n","protected":false},"featured_media":236661,"template":"","meta":{"rank_math_lock_modified_date":false,"ep_exclude_from_search":false},"product_cat":[2641],"product_tag":[],"class_list":{"0":"post-236654","1":"product","2":"type-product","3":"status-publish","4":"has-post-thumbnail","6":"product_cat-bsi","8":"first","9":"instock","10":"sold-individually","11":"shipping-taxable","12":"purchasable","13":"product-type-simple"},"_links":{"self":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product\/236654","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/types\/product"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/media\/236661"}],"wp:attachment":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/media?parent=236654"}],"wp:term":[{"taxonomy":"product_cat","embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product_cat?post=236654"},{"taxonomy":"product_tag","embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product_tag?post=236654"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}