BS EN 62047-11:2013
$142.49
Semiconductor devices. Micro-electromechanical devices – Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
| Published By | Publication Date | Number of Pages |
| BSI | 2013 | 24 |
IEC 62047-11:2013 specifies the test method to measure the linear thermal expansion coefficients (CLTE) of thin free-standing solid (metallic, ceramic, polymeric, etc.) micro-electro-mechanical system (MEMS) materials with length between 0,1 mm and 1 mm and width between 10 micrometre and 1 mm and thickness between 0,1 micrometre and 1 mm, which are main structural materials used for MEMS, micromachines and others. This test method is applicable for the CLTE measurement in the temperature range from room temperature to 30 % of a material’s melting temperature.
PDF Catalog
| PDF Pages | PDF Title |
|---|---|
| 6 | English CONTENTS |
| 7 | 1 Scope 2 Normative References 3 Symbols and designations Tables Table 1 – Symbols and designations |
| 8 | 4 Test piece 4.1 General 4.2 Shape of test piece 4.3 Test piece thickness Figures Figure 1 – Thin film test piece |
| 9 | 4.4 In-plane type test piece 4.5 Out-of-plane type test piece 5 Testing method and test apparatus 5.1 Measurement principle 5.1.1 General |
| 10 | 5.1.2 In-plane method 5.1.3 Out-of-plane method Figure 2 – CLTE measurement principles |
| 11 | 5.2 Test apparatus 5.2.1 General 5.2.2 In-plane method 5.2.3 Out-of-plane method 5.3 Temperature measurement 5.4 In-plane test piece handling |
| 12 | 5.5 Thermal strain measurement 5.6 Heating speed 5.7 Data analysis 5.7.1 General 5.7.2 Terminal-based calculation 5.7.3 Slope calculation by linear least squares method 6 Test report |
| 14 | Annex A (informative) Test piece fabrication Figure A.1 – Schematic test piece fabrication process |
| 15 | Annex B (informative) Test piece handling example Figure B.1 – Auxiliary jigs and a specimen example |
| 16 | Annex C (informative) Test piece releasing process Figure C.1 – Schematic illustration showing the test piece releasing process |
| 17 | Annex D (informative) Out-of-plane test setup and test piece example Figure D.1 – Example of test setup and test piece |
| 18 | Annex E (informative) Data analysis example in in-plane test method Figure E.1 – Example of CLTE measurement with an aluminium test piece |
| 19 | Annex F (informative) Data analysis example in out-of-plane test method |
| 20 | Figure F.1 – Example of CLTE measurement with a gold test piece |
| 21 | Bibliography |
