ASTM-F638 1995

$35.75

F638-88(1995)e1 Standard Specification for Fine Aluminum-1% Magnesium Wire for Semiconductor Lead-Bonding

Published By	Publication Date	Number of Pages
ASTM	1995	3

Guaranteed Safe Checkout

Category: ASTM

If you have any questions, feel free to reach out to our online customer service team by clicking on the bottom right corner. We’re here to assist you 24/7.
Email:[email protected]

Description

ASTM F638-88-e1-Reapproved1995

Historical Standard: Standard Specification for Fine Aluminum-1% Magnesium Wire for Semiconductor Lead-Bonding

ASTM F638

Scope

1.1 This specification covers aluminum-1% magnesium alloy wire for internal connections in semiconductor devices and is limited to wires of diameter up to and including 0.002 in. (0.051 mm). For diameters larger than 0.0020 in. (0.051 mm), the specifications are to be agreed upon between the purchaser and the supplier.

1.2 The values stated in inch-pound units are to be regarded as the standard. The values stated in parentheses are for information only.

Keywords

magnesium aluminum wire; wire bonding

ICS Code

ICS Number Code n/a

DOI: 10.1520/F0638-88R95E01

Additional information

Standard Title	F638-88(1995)e1 Standard Specification for Fine Aluminum-1% Magnesium Wire for Semiconductor Lead-Bonding
Published Code	ASTM
Publication Date	1995
Pages Count	3