BS EN IEC 61191-1:2018

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Printed board assemblies – Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies

Published By	Publication Date	Number of Pages
BSI	2018	50

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Description

This part of IEC 61191 prescribes requirements for materials, methods and verification criteria for producing quality soldered interconnections and assemblies using surface mount and related assembly technologies. This part of IEC 61191 also includes recommendations for good manufacturing processes.

Additional information

Status	Under Review
Pages	50
Publication Date	2018-11-13
ISBN	978 0 580 91108 8
Standard Number	BS EN IEC 61191-1:2018
Title	Printed board assemblies – Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
Identical National Standard Of	IEC 61191-1:2018, EN IEC 61191-1:2018, EN 62129-2:2011
Descriptors	Classification systems, Assessed quality, Electrical resistance, Soldering, Inspection, Components, Electrical components, Design, Quality assurance, Personnel, Fluxes (materials), Coating processes, Electronic equipment and components, Verification, Defects, Process control, Approval testing, Wettability, Printed circuits, Working conditions (physical), Printed-circuit boards, Integrated circuits, Ordering, Quality assurance systems, Conformity, Acceptance (approval), Joints, Flatness (surface), Surface mounting, Semiconductor devices, Assembling, Wires, Microassembling, Performance, Surface mounting devices, Cleaning, Visual inspection (testing), Contaminants
Publisher	BSI
Committee	EPL/501
ICS Codes	31.240 - Mechanical structures for electronic equipment

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BS EN IEC 61191-1:2018

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