BS EN 60749-16:2003:2004 Edition
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Semiconductor devices. Mechanical and climatic test methods – Particle impact noise detection (PIND)
| Published By | Publication Date | Number of Pages |
| BSI | 2004 | 10 |
Defines a test aiming at detecting the presence of loose particles inside a cavity device such as, for example, chips of ceramic, pieces of bonding wire or solder balls (prills).
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