BS 3934-5:1997

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Mechanical standardization of semiconductor devices – Recommendations applying to tape automated bonding (TAB) of integrated circuits

Published By	Publication Date	Number of Pages
BSI	1997	38

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Categories: 31.080.01 - Semiconductor devices in general, BSI

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Description

This part of IEC 60191 on mechanical standardization gives recommendations applying to integrated circuits supplied in packages using tape automated bonding (TAB) as the principal component for structural and interconnection functions. This standard is applicable to the finished component supplied by a manufacturer to a user and does not define requirements relating to the IC to tape interface (the inner lead bond or ILB).

Applicable to the finished component supplied to a user and does not define requirements relating to the IC to tape interface (the inner lead bond or ILB).

Additional information

Status	Definitive
Pages	38
Publication Date	1997-09-15
ISBN	0 580 27812 3
Standard Number	BS 3934-5:1997, IEC 60191-5:1997
Title	Mechanical standardization of semiconductor devices – Recommendations applying to tape automated bonding (TAB) of integrated circuits
Identical National Standard Of	IEC 60191-5:1997
Replaces	BS 3934-5:1992
Descriptors	Dimensional tolerances, Tape, Films (states of matter), Perforations, Mechanical behaviour of materials, Datum, Mechanical properties of materials, Dimensions, Standardization, Codes, Bonding, Electronic equipment and components, Holes, Electrical connections, Flexible materials, Integrated circuits, Semiconductor devices
Publisher	BSI
Committee	EH/3
ICS Codes	31.080.01 - Semiconductor devices in general

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BS 3934-5:1997

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