{"id":431417,"date":"2024-10-20T07:28:06","date_gmt":"2024-10-20T07:28:06","guid":{"rendered":"https:\/\/pdfstandards.shop\/product\/uncategorized\/bs-en-iec-60115-12023-tc\/"},"modified":"2024-10-26T14:11:54","modified_gmt":"2024-10-26T14:11:54","slug":"bs-en-iec-60115-12023-tc","status":"publish","type":"product","link":"https:\/\/pdfstandards.shop\/product\/publishers\/bsi\/bs-en-iec-60115-12023-tc\/","title":{"rendered":"BS EN IEC 60115-1:2023 – TC"},"content":{"rendered":"
IEC 60115-1:2020 is a generic specification and is applicable to fixed resistors for use in electronic equipment. It establishes standard terms, inspection procedures and methods of test for use in sectional and detail specifications of electronic components for quality assessment or any other purpose.This edition contains the following significant technical changes with respect to the previous edition: <\/p>\n
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248<\/td>\n | undefined <\/td>\n<\/tr>\n | ||||||
250<\/td>\n | European foreword <\/td>\n<\/tr>\n | ||||||
252<\/td>\n | 11 Addition of Annex ZA <\/td>\n<\/tr>\n | ||||||
255<\/td>\n | 12 Addition of a new Annex ZX Table ZX.1 \u2014 Cross-references for references to clauses <\/td>\n<\/tr>\n | ||||||
257<\/td>\n | Table ZX.2 \u2014 Cross-references for references to figures <\/td>\n<\/tr>\n | ||||||
258<\/td>\n | Table ZX.3 \u2014 Cross reference for references to tables <\/td>\n<\/tr>\n | ||||||
259<\/td>\n | English CONTENTS <\/td>\n<\/tr>\n | ||||||
263<\/td>\n | FOREWORD <\/td>\n<\/tr>\n | ||||||
266<\/td>\n | INTRODUCTION <\/td>\n<\/tr>\n | ||||||
267<\/td>\n | Figures Figure 1 \u2013 Hierarchical system of specifications <\/td>\n<\/tr>\n | ||||||
268<\/td>\n | 1 Scope 2 Normative references <\/td>\n<\/tr>\n | ||||||
270<\/td>\n | 3 Terms, definitions, product technologies and product classifications 3.1 Terms and definitions <\/td>\n<\/tr>\n | ||||||
271<\/td>\n | Figure 2 \u2013 Voltage and dissipation on a resistor below and above its critical resistance <\/td>\n<\/tr>\n | ||||||
277<\/td>\n | 3.2 Product technologies <\/td>\n<\/tr>\n | ||||||
280<\/td>\n | 3.3 Resistor encapsulations <\/td>\n<\/tr>\n | ||||||
281<\/td>\n | 3.4 Product classification <\/td>\n<\/tr>\n | ||||||
282<\/td>\n | 4 General requirements 4.1 Units and symbols 4.2 Preferred values <\/td>\n<\/tr>\n | ||||||
283<\/td>\n | 4.3 Coding 4.4 Marking of the resistors 4.5 Marking of the packaging <\/td>\n<\/tr>\n | ||||||
284<\/td>\n | 4.6 Ordering designation 4.7 Permissible substitutions <\/td>\n<\/tr>\n | ||||||
285<\/td>\n | 4.8 Packaging <\/td>\n<\/tr>\n | ||||||
286<\/td>\n | 4.9 Storage 4.10 Transportation <\/td>\n<\/tr>\n | ||||||
287<\/td>\n | 5 General provisions for measurements and test methods 5.1 General 5.2 Standard atmospheric conditions Tables Table 1 \u2013 Reference atmospheric conditions <\/td>\n<\/tr>\n | ||||||
288<\/td>\n | Table 2 \u2013 Referee atmospheric conditions Table 3 \u2013 Standard atmospheric conditions for testing <\/td>\n<\/tr>\n | ||||||
289<\/td>\n | 5.3 Tolerances on test severity parameters Table 4 \u2013 Controlled atmospheric conditions for recovery Table 5 \u2013 Default tolerances on temperature specifications Table 6 \u2013 Default tolerances on voltage specifications <\/td>\n<\/tr>\n | ||||||
290<\/td>\n | 5.4 Drying 5.5 Mounting of specimens Table 7 \u2013 Default tolerances on duration specifications Table 8 \u2013 Specimen drying procedures <\/td>\n<\/tr>\n | ||||||
292<\/td>\n | 5.6 Measurement of resistance Table 9 \u2013 Voltages for resistance measurement <\/td>\n<\/tr>\n | ||||||
293<\/td>\n | Figure 3 \u2013 Standard measurement points on a leaded resistor Figure 4 \u2013 Standard measurement points on an SMD resistor <\/td>\n<\/tr>\n | ||||||
294<\/td>\n | 6 Electrical measurements and tests 6.1 Resistance Figure 5 \u2013 Measurement points on an assembled SMD resistor <\/td>\n<\/tr>\n | ||||||
295<\/td>\n | Figure 6 \u2013 Permissible resistance range due to tolerance <\/td>\n<\/tr>\n | ||||||
296<\/td>\n | 6.2 Temperature coefficient of resistance Figure 7 \u2013 Permissible resistance range due to tolerance and TCR Figure 8 \u2013 Variation of resistance with temperature (example) <\/td>\n<\/tr>\n | ||||||
297<\/td>\n | Table 10 \u2013 Sequence of temperatures and measurements <\/td>\n<\/tr>\n | ||||||
299<\/td>\n | 6.3 Inductance <\/td>\n<\/tr>\n | ||||||
300<\/td>\n | Figure 9 \u2013 Test circuit for measurement of the inductance <\/td>\n<\/tr>\n | ||||||
301<\/td>\n | 6.4 Voltage coefficient of resistance Figure 10 \u2013 Exponential voltage rise caused by inductance <\/td>\n<\/tr>\n | ||||||
302<\/td>\n | 6.5 Nonlinearity <\/td>\n<\/tr>\n | ||||||
303<\/td>\n | 6.6 Current noise <\/td>\n<\/tr>\n | ||||||
304<\/td>\n | 6.7 Temperature rise <\/td>\n<\/tr>\n | ||||||
305<\/td>\n | 7 Endurance tests 7.1 Endurance at the rated temperature 70 \u00b0C <\/td>\n<\/tr>\n | ||||||
306<\/td>\n | Figure 11 \u2013 Standard derating curve for the rated dissipation P70 <\/td>\n<\/tr>\n | ||||||
307<\/td>\n | 7.2 Endurance at room temperature <\/td>\n<\/tr>\n | ||||||
310<\/td>\n | Figure 12 \u2013 Derating curve with specification of a suitable test dissipation Figure 13 \u2013 Derating curve without specification of a suitable test dissipation <\/td>\n<\/tr>\n | ||||||
312<\/td>\n | 7.3 Endurance at a maximum temperature <\/td>\n<\/tr>\n | ||||||
314<\/td>\n | Figure 14 \u2013 Derating curve for UCT \u2265 MET Figure 15 \u2013 Derating curve for UCT < MET <\/td>\n<\/tr>\n | ||||||
316<\/td>\n | 8 Electrical overload tests 8.1 Short-term overload <\/td>\n<\/tr>\n | ||||||
318<\/td>\n | 8.2 Single-pulse high-voltage overload test <\/td>\n<\/tr>\n | ||||||
319<\/td>\n | Figure 16 \u2013 Parameters of an open-circuit lightning impulse voltage <\/td>\n<\/tr>\n | ||||||
320<\/td>\n | Figure 17 \u2013 Circuit for generation of 1,2\/50 pulses <\/td>\n<\/tr>\n | ||||||
321<\/td>\n | Figure 18 \u2013 Circuit for generation of 10\/700 pulses <\/td>\n<\/tr>\n | ||||||
322<\/td>\n | Table 11 \u2013 Severities for the single-pulse high-voltage overload test <\/td>\n<\/tr>\n | ||||||
323<\/td>\n | 8.3 Periodic-pulse high-voltage overload test <\/td>\n<\/tr>\n | ||||||
325<\/td>\n | 8.4 Periodic-pulse overload test Table 12 \u2013 Severities for the periodic-pulse high-voltage overload test <\/td>\n<\/tr>\n | ||||||
327<\/td>\n | 8.5 Electrostatic discharge <\/td>\n<\/tr>\n | ||||||
328<\/td>\n | 9 Mechanical measurements and tests 9.1 Visual examination <\/td>\n<\/tr>\n | ||||||
329<\/td>\n | 9.2 Gauging of dimensions <\/td>\n<\/tr>\n | ||||||
330<\/td>\n | 9.3 Detail dimensions <\/td>\n<\/tr>\n | ||||||
331<\/td>\n | 9.4 Robustness of the resistor body <\/td>\n<\/tr>\n | ||||||
332<\/td>\n | 9.5 Robustness of terminations Figure 19 \u2013 Testing of resistor body robustness <\/td>\n<\/tr>\n | ||||||
333<\/td>\n | Table 13 \u2013 Tensile test force for wire terminations <\/td>\n<\/tr>\n | ||||||
335<\/td>\n | 9.6 Robustness of threaded stud or screw terminations Table 14 \u2013 Test torque for threaded studs, screws and integral mounting devices <\/td>\n<\/tr>\n | ||||||
336<\/td>\n | 9.7 Shear test <\/td>\n<\/tr>\n | ||||||
337<\/td>\n | Figure 20 \u2013 Shear test for SMD resistors <\/td>\n<\/tr>\n | ||||||
338<\/td>\n | 9.8 Substrate bending test Table 15 \u2013 Recommended parameters for the substrate bending test <\/td>\n<\/tr>\n | ||||||
339<\/td>\n | Figure 21 \u2013 Substrate bending test for SMD resistors <\/td>\n<\/tr>\n | ||||||
340<\/td>\n | 9.9 Bump <\/td>\n<\/tr>\n | ||||||
341<\/td>\n | 9.10 Shock Table 16 \u2013 Recommended parameters for the bump test <\/td>\n<\/tr>\n | ||||||
342<\/td>\n | 9.11 Vibration Table 17 \u2013 Recommended parameters for the shock test <\/td>\n<\/tr>\n | ||||||
343<\/td>\n | Table 18 \u2013 Recommended parameters for the vibration test <\/td>\n<\/tr>\n | ||||||
344<\/td>\n | 10 Environmental and climatic tests 10.1 Rapid change of temperature <\/td>\n<\/tr>\n | ||||||
345<\/td>\n | 10.2 Operation at low temperature Table 19 \u2013 Recommended parameters for the rapid change of temperature test <\/td>\n<\/tr>\n | ||||||
346<\/td>\n | 10.3 Climatic sequence <\/td>\n<\/tr>\n | ||||||
348<\/td>\n | Table 20 \u2013 Number of additional damp heat cycles <\/td>\n<\/tr>\n | ||||||
349<\/td>\n | 10.4 Damp heat, steady state <\/td>\n<\/tr>\n | ||||||
350<\/td>\n | Table 21 \u2013 Severity parameters for the damp heat, steady state test <\/td>\n<\/tr>\n | ||||||
351<\/td>\n | Table 22 \u2013 Bias voltage for the damp heat, steady state test <\/td>\n<\/tr>\n | ||||||
352<\/td>\n | 10.5 Damp heat, steady state, accelerated <\/td>\n<\/tr>\n | ||||||
353<\/td>\n | Table 23 \u2013 Severity parameters for the accelerated damp heat, steady state test <\/td>\n<\/tr>\n | ||||||
354<\/td>\n | 10.6 Corrosion Table 24 \u2013 Grouped DC bias voltages for < 25 % deviation <\/td>\n<\/tr>\n | ||||||
355<\/td>\n | Table 25 \u2013 Recommended parameters for the corrosion test <\/td>\n<\/tr>\n | ||||||
356<\/td>\n | 10.7 Whisker growth test <\/td>\n<\/tr>\n | ||||||
357<\/td>\n | 10.8 Hydrogen sulphide test Table 26 \u2013 Test methods and parameters for the whisker growth test <\/td>\n<\/tr>\n | ||||||
358<\/td>\n | 11 Tests related to component assembly 11.1 Solderability Table 27 \u2013 Selection of accelerated ageing methods of IEC 60068-2-20 <\/td>\n<\/tr>\n | ||||||
359<\/td>\n | Table 28 \u2013 Process temperatures for selected solder alloy examples <\/td>\n<\/tr>\n | ||||||
360<\/td>\n | Table 29 \u2013 Solderability test parameters for SMD resistors <\/td>\n<\/tr>\n | ||||||
361<\/td>\n | Table 30 \u2013 Solderability test parameters for resistors with wire or tag terminations <\/td>\n<\/tr>\n | ||||||
362<\/td>\n | 11.2 Resistance to soldering heat <\/td>\n<\/tr>\n | ||||||
363<\/td>\n | Table 31 \u2013 Resistance to soldering heat test parameters for SMD resistors Table 32 \u2013 RSH test parameters for resistors with wire or tag terminations <\/td>\n<\/tr>\n | ||||||
364<\/td>\n | 11.3 Solvent resistance <\/td>\n<\/tr>\n | ||||||
366<\/td>\n | 12 Tests related to safety 12.1 Insulation resistance Table 33 \u2013 Recommended parameters for the solvent resistance test <\/td>\n<\/tr>\n | ||||||
367<\/td>\n | Figure 22 \u2013 V-block fixture <\/td>\n<\/tr>\n | ||||||
368<\/td>\n | Figure 23 \u2013 Foil method applied to a resistor specimen Figure 24 \u2013 Mounting method applied to a resistor specimen <\/td>\n<\/tr>\n | ||||||
369<\/td>\n | Figure 25 \u2013 Parallel clamp fixture for rectangular SMD resistors <\/td>\n<\/tr>\n | ||||||
370<\/td>\n | Figure 26 \u2013 V-clamp test fixture for cylindrical SMD resistors <\/td>\n<\/tr>\n | ||||||
371<\/td>\n | 12.2 Voltage proof Table 34 \u2013 Insulation resistance measuring voltage <\/td>\n<\/tr>\n | ||||||
372<\/td>\n | 12.3 Accidental overload test <\/td>\n<\/tr>\n | ||||||
374<\/td>\n | Figure 27 \u2013 Gauze fixture for axial cylindrical specimens <\/td>\n<\/tr>\n | ||||||
375<\/td>\n | Figure 28 \u2013 Gauze fixture dimensions for cylindrical specimens <\/td>\n<\/tr>\n | ||||||
376<\/td>\n | Figure 29 \u2013 Gauze fixture dimensions for non-cylindrical specimens <\/td>\n<\/tr>\n | ||||||
377<\/td>\n | 12.4 Flammability Table 35 \u2013 Recommended parameters for the accidental overload test <\/td>\n<\/tr>\n | ||||||
378<\/td>\n | 13 Quality assessment procedures <\/td>\n<\/tr>\n | ||||||
380<\/td>\n | Annexes Annex A (normative) Symbols and abbreviated terms <\/td>\n<\/tr>\n | ||||||
386<\/td>\n | Annex B (normative) Rules for the preparation of detail specifications for resistors and capacitors for electronic equipment for use within the IECQ system <\/td>\n<\/tr>\n | ||||||
387<\/td>\n | Annex C (informative) Example of a certified test record <\/td>\n<\/tr>\n | ||||||
389<\/td>\n | Annex Q (informative) Quality assessment procedures Q.1 General <\/td>\n<\/tr>\n | ||||||
393<\/td>\n | Q.2 IECQ Approved Component (IECQ AC) procedures <\/td>\n<\/tr>\n | ||||||
394<\/td>\n | Q.3 IECQ Qualification Approval (QA) procedures <\/td>\n<\/tr>\n | ||||||
395<\/td>\n | Q.4 IECQ Approved Component \u2013 Capability Certification (IECQ AC-C) procedures <\/td>\n<\/tr>\n | ||||||
397<\/td>\n | Q.5 IECQ Approved Component \u2013 Technology Certification (IECQ AC-TC) procedure <\/td>\n<\/tr>\n | ||||||
400<\/td>\n | Annex R (informative) Failure rate level evaluation, determination and qualification R.1 General <\/td>\n<\/tr>\n | ||||||
401<\/td>\n | R.2 Certification and determination of a failure rate level <\/td>\n<\/tr>\n | ||||||
402<\/td>\n | Table R.1 \u2013 Requirements for the qualification of a failure rate level <\/td>\n<\/tr>\n | ||||||
403<\/td>\n | R.3 Non-conformances R.4 Extension of a qualification to a higher failure rate level R.5 Maintenance of a failure rate level <\/td>\n<\/tr>\n | ||||||
404<\/td>\n | R.6 Deliveries Table R.2 \u2013 Requirements for the maintenance of a failure rate level qualification <\/td>\n<\/tr>\n | ||||||
405<\/td>\n | R.7 Determination of a component failure rate <\/td>\n<\/tr>\n | ||||||
407<\/td>\n | Table R.3 \u2013 Environmental factor \u03c0E for determination of the component failure rate Table R.4 \u2013 Quality factor \u03c0Q for determination of the component failure rate <\/td>\n<\/tr>\n | ||||||
408<\/td>\n | Annex X (informative)Cross-references for references to the prior revision of this document Table X.1 \u2013 Cross-references for references to clauses (1 of 3) <\/td>\n<\/tr>\n | ||||||
409<\/td>\n | Bibliography <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":" Tracked Changes. Fixed resistors for use in electronic equipment – Generic specification<\/b><\/p>\n |