This part of IEC 62321 provides strategies of sampling along with the mechanical preparation of samples from electrotechnical products. These samples can be used for analytical testing to determine the levels of certain substances as described in the test methods in other parts of the IEC 62321 series. Restrictions for substances will vary between geographic regions and can be updated on a regular basis. This document describes a generic process for obtaining and preparing samples prior to the determination of any substance of concern. This document does not provide: – full guidance on each and every product that could be classified as electrotechnical product. Since there is a huge variety of electrotechnical parts, with various structures and compositions, along with the continuous innovations in the industry, it is unrealistic to attempt to provide procedures for the disjointment of every type of part; – guidance regarding other routes to gather additional information on certain substances in a product, although the information collected has relevance to the sampling strategies in this document; – safe disassembly and mechanical disjointment instructions related to electrotechnical products (e.g. mercury-containing switches) and the recycling industry (e.g. how to handle CRTs or the safe removal of batteries). See IEC 62554 [1] 1 for the disjointment and mechanical sample preparation of mercury-containing fluorescent lamps; – sampling procedures for packaging and packaging materials; – analytical procedures to measure the levels of certain substances. This is covered by other standards (e.g. other parts of the IEC 62321 series), which are referred to as “test standards” in this document; – guidelines for assessment of compliance. This document has the status of a horizontal standard in accordance with IEC Guide 108 [2].<\/p>\n
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| 2<\/td>\n | undefined <\/td>\n<\/tr>\n | ||||||
| 5<\/td>\n | Annex ZA (normative)Normative references to international publicationswith their corresponding European publications <\/td>\n<\/tr>\n | ||||||
| 7<\/td>\n | English CONTENTS <\/td>\n<\/tr>\n | ||||||
| 10<\/td>\n | FOREWORD <\/td>\n<\/tr>\n | ||||||
| 12<\/td>\n | INTRODUCTION <\/td>\n<\/tr>\n | ||||||
| 13<\/td>\n | 1 Scope 2 Normative references <\/td>\n<\/tr>\n | ||||||
| 14<\/td>\n | 3 Terms, definitions and abbreviated terms 3.1 Terms and definitions 3.2 Abbreviated terms <\/td>\n<\/tr>\n | ||||||
| 15<\/td>\n | 4 Introduction to sampling 4.1 Introductory remarks 4.2 Requirements for certain substances <\/td>\n<\/tr>\n | ||||||
| 16<\/td>\n | 4.3 Complexity of electrotechnical products and related challenges <\/td>\n<\/tr>\n | ||||||
| 17<\/td>\n | 4.4 Sampling procedure Figures Figure 1 \u2013 Generic iterative procedure for sampling strategy <\/td>\n<\/tr>\n | ||||||
| 18<\/td>\n | 4.5 Scope of the analysis <\/td>\n<\/tr>\n | ||||||
| 19<\/td>\n | 4.6 Purpose of the analysis 4.7 Testing strategy <\/td>\n<\/tr>\n | ||||||
| 20<\/td>\n | 5 Sampling plan 5.1 Introductory remarks 5.2 Sampling of a complete product <\/td>\n<\/tr>\n | ||||||
| 21<\/td>\n | 5.3 Partial disassembly 5.4 Complete disassembly 5.5 Partial disjointment 5.6 Complete disjointment <\/td>\n<\/tr>\n | ||||||
| 22<\/td>\n | 5.7 Test sample considerations 5.7.1 Introductory remarks 5.7.2 Required sample size Tables Table 1 \u2013 Minimum number of lead frame samples required for analytical testing <\/td>\n<\/tr>\n | ||||||
| 23<\/td>\n | 5.7.3 Sample size versus detection limit <\/td>\n<\/tr>\n | ||||||
| 24<\/td>\n | 5.7.4 Composite sample considerations 5.7.5 Non-uniform “homogeneous materials” Table 2 \u2013 Levels of a certain substance (e.g. Pb) in a composite sample <\/td>\n<\/tr>\n | ||||||
| 25<\/td>\n | Figure 2 \u2013 Cross-section of a 900 \u00b5m wide lead oxide-based resistor (SMD) <\/td>\n<\/tr>\n | ||||||
| 26<\/td>\n | 5.7.6 Determination of sampling of homogeneous materials from different positions 6 Conclusions and recommendations for sampling 7 Mechanical sample preparation 7.1 Overview 7.1.1 Field of application <\/td>\n<\/tr>\n | ||||||
| 27<\/td>\n | 7.1.2 Quality assurance 7.2 Apparatus, equipment and materials <\/td>\n<\/tr>\n | ||||||
| 28<\/td>\n | 7.3 Procedure 7.3.1 General 7.3.2 Manual cutting 7.3.3 Coarse grinding or milling 7.3.4 Homogenizing 7.3.5 Fine grinding or milling <\/td>\n<\/tr>\n | ||||||
| 29<\/td>\n | 7.3.6 Very fine grinding of polymers and organic materials <\/td>\n<\/tr>\n | ||||||
| 30<\/td>\n | Annex A (informative)Examples of procedures for sampling and disjointment <\/td>\n<\/tr>\n | ||||||
| 31<\/td>\n | Figure A.1 \u2013 Methodology for sampling and disjointment <\/td>\n<\/tr>\n | ||||||
| 32<\/td>\n | Figure A.2 \u2013 Sampling of DVD player <\/td>\n<\/tr>\n | ||||||
| 33<\/td>\n | Figure A.3 \u2013 Sampling of LCD TV <\/td>\n<\/tr>\n | ||||||
| 34<\/td>\n | Figure A.4 \u2013 Sampling of PDA <\/td>\n<\/tr>\n | ||||||
| 35<\/td>\n | Figure A.5 \u2013 Sampling of desk fan <\/td>\n<\/tr>\n | ||||||
| 36<\/td>\n | Figure A.6 \u2013 Sampling of parts \u2013 Thick film resistor <\/td>\n<\/tr>\n | ||||||
| 37<\/td>\n | Figure A.7 \u2013 Sampling of parts \u2013 SMD potentiometer <\/td>\n<\/tr>\n | ||||||
| 38<\/td>\n | Annex B (informative)Probability of the presence of certain substances Table B.1 \u2013 Probability of the presence of certain substances in materialsand parts used in electrotechnical products <\/td>\n<\/tr>\n | ||||||
| 41<\/td>\n | Table B.2 \u2013 Probability of the presence of additionalcertain substances in polymeric materials <\/td>\n<\/tr>\n | ||||||
| 42<\/td>\n | Annex C (informative)Composite testing and sampling C.1 Introductory remarks C.2 Calculated maximum concentration for a composite sample based on detection limit <\/td>\n<\/tr>\n | ||||||
| 43<\/td>\n | C.3 Required detection limit for a composite sample based on the maximum allowable concentration Table C.1 \u2013 Calculated maximum concentration for a composite samplebased on detection limit <\/td>\n<\/tr>\n | ||||||
| 44<\/td>\n | Table C.2 \u2013 Required detection limit for a composite sample based onthe maximum allowable concentration <\/td>\n<\/tr>\n | ||||||
| 45<\/td>\n | Annex D (informative)Tools used in sampling Figure D.1 \u2013 Hot gas gun for removing electronic parts Figure D.2 \u2013 Vacuum pin to remove target electronic devices <\/td>\n<\/tr>\n | ||||||
| 46<\/td>\n | Annex E (informative)Examples of mobile phone disassembly and disjointment E.1 General E.2 Partial disassembly without tools \u2013 Mobile phone type A Figure E.1 \u2013 Mobile phone type A with battery charger and camera lens cap <\/td>\n<\/tr>\n | ||||||
| 47<\/td>\n | Figure E.2 \u2013 Mobile phone type A with battery and back cover removed Table E.1 \u2013 Possible certain substances or screening substancesfrom a mobile phone (type A) <\/td>\n<\/tr>\n | ||||||
| 48<\/td>\n | E.3 Partial disassembly with simple tools \u2013 Mobile phone type B Figure E.3 \u2013 Partial disassembly of a mobile phone (type B) into its major parts Table E.2 \u2013 Possible certain substances in major parts of the mobile phone (type B) <\/td>\n<\/tr>\n | ||||||
| 49<\/td>\n | E.4 Complete disassembly \u2013 Mobile phone type B Figure E.4 \u2013 Complete disassembly of key pad Figure E.5 \u2013 Complete disassembly of bottom housing <\/td>\n<\/tr>\n | ||||||
| 50<\/td>\n | E.5 Partial disjointment \u2013 Mobile phone type B Figure E.6 \u2013 Complete disassembly of other housing or frame Figure E.7 \u2013 Parts of the TFT display of the mobilephone (type B) after partial disjointment <\/td>\n<\/tr>\n | ||||||
| 51<\/td>\n | E.6 Complete disjointment \u2013 Examples of disjointment of small electronic parts Figure E.8 \u2013 Parts of the main PCB of the mobilephone (type B) after partial disjointment <\/td>\n<\/tr>\n | ||||||
| 52<\/td>\n | Table E.3 \u2013 Examples of disjointment for typical small electronic parts <\/td>\n<\/tr>\n | ||||||
| 53<\/td>\n | E.7 Complete disjointment of integrated circuit lead frame package E.8 Complete disjointment of ball grid array (BGA) package E.8.1 General Figure E.9 \u2013 Disjointment of lead frame <\/td>\n<\/tr>\n | ||||||
| 54<\/td>\n | E.8.2 Solder ball removal from BGA package \u2013 Hand removal procedure Figure E.10 \u2013 BGA package prior to disjointment Figure E.11 \u2013 BGA package disjointed by hand removal procedure <\/td>\n<\/tr>\n | ||||||
| 55<\/td>\n | E.8.3 Solder ball removal from BGA package \u2013 Solder ball shear procedure Figure E.12 \u2013 Solder ball material collected from BGA using hand removal procedure Figure E.13 \u2013 BGA solder ball removal using ball shear procedure <\/td>\n<\/tr>\n | ||||||
| 56<\/td>\n | Bibliography <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":" Determination of certain substances in electrotechnical products – Disassembly, disjointment and mechanical sample preparation<\/b><\/p>\n |