This part of IEC 60512 specifies the test methods for transmission performance for IEC 60603-7 and IEC 61076-3 series connectors up to 1 000 MHz. It is also suitable for testing lower frequency connectors, however the test methodology specified in the detailed specification for any given connector remains the reference conformance test for that connector.<\/p>\n
The test methods provided here are:<\/p>\n
insertion loss, test 28a;<\/p>\n<\/li>\n
return loss, test 28b;<\/p>\n<\/li>\n
near-end crosstalk (NEXT) test 28c;<\/p>\n<\/li>\n
far-end crosstalk (FEXT), test 28d;<\/p>\n<\/li>\n
transverse conversion loss (TCL), test 28f;<\/p>\n<\/li>\n
transverse conversion transfer loss (TCTL), test 28g.<\/p>\n<\/li>\n<\/ul>\n
For the transfer impedance (ZT) test, see IEC 60512-26-100, test 26e.<\/p>\n
For the coupling attenuation, see IEC 62153-4-12.<\/p>\n
| PDF Pages<\/th>\n | PDF Title<\/th>\n<\/tr>\n | ||||||
|---|---|---|---|---|---|---|---|
| 7<\/td>\n | English CONTENTS <\/td>\n<\/tr>\n | ||||||
| 10<\/td>\n | 1 Scope 2 Normative references <\/td>\n<\/tr>\n | ||||||
| 11<\/td>\n | 3 Terms, definitions and acronyms 3.1 Terms and definitions 3.2 Acronyms <\/td>\n<\/tr>\n | ||||||
| 12<\/td>\n | 4 Overall test arrangement 4.1 Test instrumentation 4.2 Measurement precautions <\/td>\n<\/tr>\n | ||||||
| 13<\/td>\n | 4.3 Mixed mode S-parameter nomenclature Figures Figure 1 \u2013 Diagram of a single ended 4 port device Figure 2 \u2013 Diagram of a balanced 2 port device <\/td>\n<\/tr>\n | ||||||
| 14<\/td>\n | 4.4 Coaxial cables and interconnect for network analysers 4.5 Requirements for switching matrices Tables Table 1 \u2013 Mixed mode S-parameter nomenclature <\/td>\n<\/tr>\n | ||||||
| 15<\/td>\n | 4.6 Test fixture requirements Figure 3 \u2013 Test interface pattern Table\u00a02 \u2013 Switch performance recommendations <\/td>\n<\/tr>\n | ||||||
| 16<\/td>\n | 4.7 Requirements for termination performance at calibration plane 4.8 Reference loads for calibration Table 3 \u2013 Test fixture requirements Table 4 \u2013 Requirements for terminations at calibration plane <\/td>\n<\/tr>\n | ||||||
| 17<\/td>\n | 4.9 Calibration 4.10 Termination loads for termination of conductor pairs 4.10.1 General Figure 4 \u2013 Calibration of reference loads <\/td>\n<\/tr>\n | ||||||
| 18<\/td>\n | 4.10.2 Verification of termination loads 4.11 Termination of screens 4.12 Test specimen and reference planes 4.12.1 General Figure 5 \u2013 Resistor termination networks <\/td>\n<\/tr>\n | ||||||
| 19<\/td>\n | 4.12.2 Interconnections between device under test (DUT) and the calibration plane Figure 6 \u2013 Definition of reference planes <\/td>\n<\/tr>\n | ||||||
| 21<\/td>\n | 4.13 Overall test setup requirements 5 Connector measurement up to 1 000\u00a0MHz 5.1 General Table\u00a05 \u2013 Interconnection DM return loss requirements Table 6 \u2013 Overall test setup requirements <\/td>\n<\/tr>\n | ||||||
| 22<\/td>\n | 5.2 Insertion loss, Test 28a 5.2.1 Object 5.2.2 Connecting hardware insertion loss 5.2.3 Test method 5.2.4 Test set-up 5.2.5 Procedure <\/td>\n<\/tr>\n | ||||||
| 23<\/td>\n | 5.2.6 Test report 5.2.7 Accuracy 5.3 Return loss, Test 28b 5.3.1 Object 5.3.2 Connecting hardware return loss 5.3.3 Test method Figure 7 \u2013 Insertion loss and TCTL measurement <\/td>\n<\/tr>\n | ||||||
| 24<\/td>\n | 5.3.4 Test set-up 5.3.5 Procedure 5.3.6 Test report 5.3.7 Accuracy 5.4 Near-end crosstalk (NEXT), Test 28c 5.4.1 Object 5.4.2 Connecting hardware NEXT 5.4.3 Test method <\/td>\n<\/tr>\n | ||||||
| 25<\/td>\n | 5.4.4 Test set-up 5.4.5 Procedure Figure 8 \u2013 NEXT measurement <\/td>\n<\/tr>\n | ||||||
| 26<\/td>\n | 5.4.6 Test report 5.4.7 Accuracy 5.5 Far-end crosstalk (FEXT), Test 28d 5.5.1 Object 5.5.2 Connecting hardware FEXT 5.5.3 Test method 5.5.4 Test set-up <\/td>\n<\/tr>\n | ||||||
| 27<\/td>\n | 5.5.5 Procedure 5.5.6 Test report 5.5.7 Accuracy Figure 9 \u2013 FEXT measurement <\/td>\n<\/tr>\n | ||||||
| 28<\/td>\n | 5.6 Transfer impedance (ZT), Test 28e 5.7 Transverse conversion loss (TCL), Test 28f 5.7.1 Object 5.7.2 Connecting hardware TCL 5.7.3 Test method 5.7.4 Test set-up 5.7.5 Procedure Figure 10 \u2013 Return loss and TCL measurement <\/td>\n<\/tr>\n | ||||||
| 29<\/td>\n | 5.7.6 Test report 5.7.7 Accuracy 5.8 Transverse conversion transfer loss (TCTL), Test 28g 5.8.1 Object 5.8.2 Connecting hardware TCTL <\/td>\n<\/tr>\n | ||||||
| 30<\/td>\n | 5.8.3 Test method 5.8.4 Test set-up 5.8.5 Procedure 5.8.6 Test report 5.8.7 Accuracy <\/td>\n<\/tr>\n | ||||||
| 31<\/td>\n | 5.9 Coupling attenuation <\/td>\n<\/tr>\n | ||||||
| 32<\/td>\n | Annex A (informative) Example derivation of mixed mode parameters using the modal decomposition technique Figure A.1 \u2013 Voltage and current on balanced DUT <\/td>\n<\/tr>\n | ||||||
| 33<\/td>\n | Figure A.2 \u2013 Voltage and current on unbalanced DUT <\/td>\n<\/tr>\n | ||||||
| 35<\/td>\n | Annex B (informative) Test pins \u2013 Dimensions and references Figure B.1 \u2013 Example of pin and fixed connector dimensions <\/td>\n<\/tr>\n | ||||||
| 36<\/td>\n | Bibliography <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":" Connectors for electronic equipment. Tests and measurements – Signal integrity tests up to 1000 MHz on IEC 60603-7 and IEC 61076-3 series connectors. Tests 28a to 28g<\/b><\/p>\n |