BSI 18/30375624 DC:2018 Edition

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BS EN 60749-20-1. Semiconductor devices. Mechanical and climatic test methods – Part 20-1. Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat

Published By	Publication Date	Number of Pages
BSI	2018	39

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Categories: 31.080.01 - Semiconductor devices in general, BSI

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PDF Pages

PDF Title

30375624 1

47_2488e_CDV

Status	Definitive
Pages	39
Publication Date	2018-07-13
Standard Number	18/30375624 DC
Title	BS EN 60749-20-1. Semiconductor devices. Mechanical and climatic test methods – Part 20-1. Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
Identical National Standard Of	IEC 60749-20-1 Ed.2.0
Descriptors	Climate, Materials handling, Damp-heat tests, Environment (working), Environmental testing, Packaging, Mechanical testing, Surface mounting devices, Electronic equipment and components, Integrated circuits, Soldering, Labelling (process), Thermal testing, Transportation, Semiconductor devices
Publisher	BSI
Committee	EPL/47
ICS Codes	31.080.01 - Semiconductor devices in general


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BSI 18/30375624 DC:2018 Edition

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