IEC TR 61189-5-506:2019
$43.55
Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 5-506: General test methods for materials and assemblies – An intercomparison evaluation to implement the use of fine-pitch test structures for surface insulation resistance (SIR) testing of solder fluxes in accordance with IEC 61189-5-501
| Published By | Publication Date | Number of Pages |
| IEC | 2019-06-26 | 28 |
IEC TR 61189-5-506:2019(E) is an intercomparison supporting the development of IEC 61189-5-501 in relation to the SIR method. This document sets out to validate the introduction of a new 200-µm gap SIR pattern, and was benched marked against existing SIR gap patterns of 318 µm and 500 µm.
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