BSI PD IEC/TS 62878-2-4:2015

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Device embedded substrate – Guidelines. Test element groups (TEG)

Published By	Publication Date	Number of Pages
BSI	2015	40

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Description

This part of IEC 62878 describes the test element group devices useful when measuring basic properties of device embedded substrates.

This part of IEC 62878 is applicable to device embedded substrates fabricated by use of organic base material, which include for example active or passive devices, discrete components formed in the fabrication process of electronic wiring board, and sheet formed components.

The IEC 62878 series neither applies to the re-distribution layer (RDL) nor to the electronic modules defined as an M-type business model in IEC 62421.

Additional information

Status	Definitive
Pages	40
Publication Date	2015-04-30
ISBN	978 0 580 82121 9
Standard Number	PD IEC/TS 62878-2-4:2015
Title	Device embedded substrate – Guidelines. Test element groups (TEG)
Identical National Standard Of	IEC TS 62878-2-4:2015
Descriptors	Damp-heat tests, Automatic control systems, Stability, Test equipment, Performance testing, Testing conditions, Grades (quality), Thermal testing, Environmental testing, Control systems, Transmitters, Accuracy, Installation, Flow measurement, Classification systems, Dynamic testing, Transducers, Safety measures, Drop tests, Mechanical testing, Electric power system disturbances, Accelerated testing, Maintenance, Process control, Impact testing, Interfaces (data processing), Technical documents, Industrial, Vibration testing, Electrical testing
Publisher	BSI
Committee	EPL/501
ICS Codes	31.180 - Printed circuits and boards

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BSI PD IEC/TS 62878-2-4:2015

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