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BSI PD IEC/TS 62661-2-1:2013:2014 Edition

BSI PD IEC/TS 62661-2-1:2013:2014 Edition

$167.15

Optical backplanes. Product specification – Optical backplane using optical fibre circuit boards and multi-core right angle optical connectors

Published By Publication Date Number of Pages
BSI 2014 42
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1.1 General

This part of IEC 62661 gives guidelines for an optical backplane using optical fibre boards and multi-core right angle optical connectors with low bending loss multimode fibres (hereafter called low-loss RAO) to connect daughter boards to the optical backplane.

NOTE Low bending multimode fibres are currently under study.

1.2 Product definition

The structure of an optical backplane specified in this specification is as follows

  1. The optical backplane has the structure to fit to a sub-rack specified in IEC 60297-3-101 with a height of more than 3U (44,45 mm × 3).

  2. One optical backplane occupies a space of 100 mm (height) and 420 mm (width) in the optical backplane stated in item a).

  3. A multiple number of optical backplanes may be installed to a sub-rack specified in IEC 60297-3-101 if multiple spaces specified in item b) are available, that is, a height of 44,45 mm × N (N≥5).

  4. The backplane installs maximum of 14 front boards (daughter boards) with a pitch of 6HP (30,48 mm).

  5. New Type RAO connectors specified in Annex B are used in the optical backplane.

  6. Multimode optical fibres are used for optical wiring in the optical backplane. More specifically, the optical backplane is made of an optical fibre board specified in IEC 62496-3-1 using low bending loss optical fibres.

1.3 Connection arrangement

Connection arrangement for the optical backplane is as follows:

  1. The construction of optical connection specified in this document consists of using the compact right-angled optical board connectors specified in Annex B which are mounted on an optical backplane housed in a sub-rack specified in IEC 60297-3-101.

  2. The slots are assigned the following numerical designations in this specification: the slot on the left end is designated slot number 1, and the slot on the right end is designated slot number 14. The daughter board located at slot 7 or slot 8 is defined as daughter board B, while daughter boards located on any of the other slots are defined as daughter board A. This document specifies an optical dual star connection between daughter board A and daughter board B.

1.4 Classification of connections

Connections in this specification are classified as shown in Table 1.

Table 1 – Classification of ferrules

The 16 core MT ferrule and the 24 core MT ferrule used on DS 384 optical backplane are 125 µm pitch high-density MT ferrules defined by Figure B.5.

1.5 Operating environment

The operating environment is specified in Table A.1 of IEC 62496-3:2011, Category C (temperature range of –10 °C to +60 °C).

PDF Catalog

PDF Pages PDF Title
4 CONTENTS
6 FOREWORD
8 1 Scope
1.1 General
1.2 Product definition
1.3 Connection arrangement
1.4 Classification of connections
9 1.5 Operating environment
2 Normative references
Tables
Table 1 – Classification of ferrules
10 3 Terms and definitions
11 4 Dimensional requirements
4.1 Dimension of a sub-rack
4.2 Dimension of optical wiring on optical backplane
Figures
Figure 1 – Sub-rack for optical back plane
13 4.3 Interconnection condition of connectors on optical backplane
4.4 Mounting position of connectors on optical backplane
4.5 Mounting position of connectors on daughter board
Figure 2 – Area for optical wiring and positions of optical connectors on optical backplane
Figure 3 – 8 degree angle polish of ferrule
14 5 Requirements for dual-star optical circuits connection
5.1 Assignment of the name of an optical connection point
Figure 4 – Hole positions of low loss RAO connectors on optical backplane
Figure 5 – Hole positions to mount a RAO connector to a daughter board
15 5.2 Specification of optical cable connection
Figure 6 – Assignment of connection points
16 Table 2 – DS192 Optical backplane
18 Table 3 – DS384 Optical wiring backplane
22 6 Tests
6.1 Sample size
6.2 Test and measurement methods
6.3 Test sequence
6.4 Pass/fail criteria
7 Test report
8 Product qualification requirements
8.1 Optical performance requirements
8.1.1 Test 1: Attenuation, IEC 61300-3-4, Method C
23 8.1.2 Test 2: Return loss, IEC 61300-3-6, Method: branching devices
24 8.1.3 Test 3: Optical propagation delay (fibre length), IEC 60793-1-22, Method B
8.2 Mechanical performance requirements
8.2.1 Test 4: Mating durability, IEC 61300-2-2
8.2.2 Test 5: Vibration, IEC 61300-2-1
25 8.2.3 Test 6: Shock, IEC 61300-2-9
8.3 Environmental performance requirements
8.3.1 Test 7: Cold, IEC 61300-2-17
26 8.3.2 Test 8: Dry heat, IEC 61300-2-18
9 Reliability
9.1 General
9.2 Test 9: High temperature endurance, IEC 61300-2-18
9.3 Test 10: Damp heat, IEC 61300-2-19
9.4 Test 11: Change of temperature, IEC 61300-2-22
28 Annex A (normative)Mounting an optical backplane to zone 3 of the advanced telecommunication computing architecture (ATCA) backplane
29 Figure A.1 – Mounting position of optical backplane
30 Figure A.2 – Structure of optical daughter board
31 Annex B (normative)Specification for compact right-angled optical board (CRO) connector
32 Figure B.1 – CRO connector configuration
33 Figure B.2 – CRO socket connector interface
34 Figure B.3 – CRO plug connector interface (1 of 2)
36 Figure B.4 – Optical datum target location diagrams for 0,250 mm pitch fibre arrayed
37 Figure B.5 – Optical datum target location diagrams for 0,125 mm pitch fibre arrayed
38 Table B.1 – Dimensions of the CRO socket connector interface
39 Table B.2 – Dimensions of the CRO plug connector interface
40 Bibliography

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